Printed circuit board

• US 20030030533A1
• Filed: 08/07/2002
• Published: 02/13/2003
• Est. Priority Date: 08/11/2001
• Status: Active Grant

• Current Assignee: Philips Lighting Holding BV (Signify N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Waffenschmidt, Eberhard
• Granted Patent: US 6,903,938 B2
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/09672 Superposed layout, i.e. in different planes
• CPC Class Codes: H05K 2201/09972 Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
• CPC Class Codes: H05K 2201/10416 Metallic blocks or heatsinks completely inserted in a PCB
• CPC Class Codes: H05K 3/4602 characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
• CPC Class Codes: H05K 3/4623 the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards H05K3/462 takes precedence

Abstract

The invention relates to a printed circuit board comprising capacitive and inductive elements. To arrange such a printed circuit board so that it has a smaller thickness and can be manufactured cost effectively, a printed circuit board is proposed having at least one dielectric layer, on the two side faces of which capacitor electrodes arranged opposite each other are positioned in a first area and two planar windings opposite each other are arranged in at least a second area next to the first area on the side faces of the electric layer.

Claims

1. A printed circuit board (1) with at least a dielectric layer (3a, 3b) on both side faces of which capacitor electrodes (4a, 4b, 5a, 5b, 6a, 6b, 7a, 7b) are arranged facing each other in a first area, two planar windings (10, 12) facing each other being arranged in at least a second area adjacent to the first area on the side faces of the dielectric layer (3a, 3b).

2. A printed circuit board as claimed in claim 1, characterized in that the dielectric layer (3a, 3b) is positioned between two insulating layers (2a, 2b, 2c).

3. A printed circuit board as claimed in claim 1, characterized in that the planar windings (12) positioned in the second area act both inductively and capacitively.

4. A printed circuit board as claimed in claim 1, characterized in that the two planar windings have unidirectional orientations.

5. A printed circuit board as claimed in claim 1, characterized in that the two planar windings have winding orientations in opposite directions.

6. A printed circuit board as claimed in one of the claims 1 to 5, characterized in that a third insulating layer (2c) is provided and in that on at least one side of the third insulating layer (2c) in an area facing the first planar winding (12a, 12b, 12c, 12d) at least a further, third planar winding (13a, 13b) is provided DC-isolated from the first planar winding.

7. A printed circuit board as claimed in one of the claims 1 to 6, characterized in that low-magnetic core portions (15a, 15b) are provided for conveying the magnetic flux generated by the planar windings (12a, 12b, 12c, 12d, 13a, 13b).

8. A printed circuit board as claimed in claim 7, characterized in that the core portions pass through the printed circuit board.

9. A printed circuit board as claimed in claim 7, characterized in that planar core portions are provided.

10. A printed circuit board as claimed in claim 9, characterized in that the printed circuit board has notches (34, 35, 36) which are filled with low-magnetic material.

11. A printed circuit board as claimed in one of the claims 1 to 10, characterized in that resistive elements (22a, 22b, 22c) are embedded in the printed circuit board.

12. A printed circuit board, more particularly as claimed in one of the claims 1 to 11, characterized in that further electronic components such as, for example, semiconductor components and/or CMC capacitors are embedded in the printed circuit board.

13. A printed circuit board as claimed in one of the claims 1 to 12, characterized in that at least one layer of low-magnetic material is provided which is structured so that various sub-areas of the layer perform different functions.

14. A printed circuit board as claimed in one of the claims 1 to 13, characterized in that planar magnetic core portions (107, 108) formed from the same material and planar resistive elements (101, 102) are deposited in a printed circuit board plane.