Substrate for electronic part and electronic part

• US 20030030994A1
• Filed: 08/15/2002
• Published: 02/13/2003
• Est. Priority Date: 11/16/2000
• Status: Abandoned Application

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Endo, Toshikazu, Takaya, Minoru
• Application Number:
  US10/218,317
• Publication Number:
  US 20030030994A1
• Time in Patent Office: Days
• US Class Current: 361/728
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/0026 Multilayer LC-filter
• CPC Class Codes: H01F 27/327 Encapsulating or impregnating encapsulating coil and core H01F27/022
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01F 5/06 Insulation of windings
• CPC Class Codes: H01G 4/40 Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: H01P 1/20345 Multilayer filters
• CPC Class Codes: H01P 5/10 for coupling balanced lines or devices with unbalanced lines or devices
• CPC Class Codes: H01P 5/185 Edge coupled lines
• CPC Class Codes: H01P 5/187 Broadside coupled lines
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H03F 1/22 by use of cascode coupling, i.e. earthed cathode or emitter stage followed by earthed grid or base stage respectively
• CPC Class Codes: H03H 2001/0085 Multilayer, e.g. LTCC, HTCC, green sheets
• CPC Class Codes: H03H 7/0115 comprising only inductors and capacitors H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence
• CPC Class Codes: H03H 7/1725 Element to ground being common to different shunt paths, i.e. Y-structure
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/0209 : Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/086 : for inductive purposes, e.g. printed inductor with ferrite core

Abstract

An object of the invention is to provide a substrate for an electronic part and an electronic part which have higher dielectric constant compared to conventional materials, which do not suffer from reduced strength, and which enjoy the advantages of small size, excellent performance and improved overall electrical characteristics; a substrate for an electronic part and an electronic part wherein the material used for the production exhibits reduced lot-to-lot variation in the electric properties, and in particular, in the dielectric constant, and wherein wearing of the mold in the production of the material has been suppressed; and a substrate for an electronic part and an electronic part which have a high withstand voltage. In order to attain such object, the substrate for an electronic part and the electronic part are constituted to comprise a composite dielectric material wherein at least a dielectric material having a circular, oblate circular or oval projection shape is dispersed in a resin.

Claims

1. A substrate for an electronic part comprising a composite dielectric material wherein said composite dielectric material has at least a dielectric material having a circular, oblate circular or oval projection shape dispersed in a resin.

2. A substrate for an electronic part according to claim 1 wherein said dielectric material having a projected image of circle has a mean particle size of 1 to 50 μ

m and a sphericity of 0.9 to 1.0.

3. A substrate for an electronic part according to claim 1 or 2 wherein said composite dielectric material further comprises a magnetic powder.

4. A substrate for an electronic part according to claim 1 wherein said composite dielectric material further comprises a pulverized material.

5. A substrate for an electronic part according to claim 1 wherein said composite dielectric material further comprises a glass cloth embedded in the material.

6. A substrate for an electronic part according to claim 1 comprising two or more different composite dielectric materials.

7. A substrate for an electronic part according to claim 1 comprising at least one composite dielectric material and one or more flame retardant.

8. An electronic part comprising the substrate for an electronic part of claim 1.