Packaging and rf shielding for telecoils

• US 20030031339A1
• Filed: 07/09/2002
• Published: 02/13/2003
• Est. Priority Date: 01/13/2000
• Status: Abandoned Application

• Current Assignee: Sonionmicrotronic Nederland B.V.
• Original Assignee: Sonionmicrotronic Nederland B.V.
• Inventors: Fransen, Alwin, Marshall, Bowen F.
• Application Number:
  US10/169,817
• Publication Number:
  US 20030031339A1
• Time in Patent Office: Days
• US Class Current: 381/400
• CPC Class Codes: H01Q 1/27 Adaptation for use in or on movable bodies H01Q1/08, H01Q1/12, H01Q1/18 take precedence
• CPC Class Codes: H01Q 1/526 Electromagnetic shields
• CPC Class Codes: H01Q 7/06 with core of ferromagnetic material H01Q7/02 takes precedence
• CPC Class Codes: H01Q 7/08 Ferrite rod or like elongated core
• CPC Class Codes: H04R 2225/49 Reducing the effects of electromagnetic noise on the functioning of hearing aids, by, e.g. shielding, signal processing adaptation, selective (de)activation of electronic parts in hearing aid
• CPC Class Codes: H04R 2225/51 Aspects of antennas or their circuitry in or for hearing aids
• CPC Class Codes: H04R 25/554 using a wireless connection, e.g. between microphone and amplifier or using Tcoils

Abstract

Disclosed is a convenient way of mounting the microphone array and associated electronics of a hearing aid on the person, and providing a convenient wireless means for delivering the microphone signals to the ear, and providing a signal processing technique that yields sharp directivity at audio frequencies. The wearer positions her/his body to receive the desired signal and to attenuate surrounding background noise and multipath interference.

Claims

1. A packaged telecoil assembly, comprising:

a telecoil induced by an external magnetic field to create an output signal corresponding to said external magnetic field, said telecoil joined to a substrate; and

a cover joined with said substrate to enclose said telecoil.

2. The packaged telecoil assembly of claim 1, further including an integrated circuit capable of receiving a signal from said telecoil, said integrated circuit connected to said substrate and enclosed by said cover.

3. The packaged telecoil assembly of claim 2, wherein said telecoil is mounted to said integrated circuit.

4. The packaged telecoil assembly of claim 3, wherein said telecoil has a side, said side of said telecoil is mounted to said integrated circuit.

5. The packaged telecoil assembly of claim 3, wherein said telecoil has an end, said end of said telecoil is mounted to said integrated circuit.

6. The packaged telecoil assembly of claim 1, wherein said cover has a rectangular shape.

7. The packaged telecoil assembly of claim 1, wherein said cover has a barn shape.

8. The packaged telecoil assembly of claim 1, wherein said cover has a cylindrical shape.

9. The packaged telecoil assembly of claim 1, wherein said cover is electrically conductive and at least partially nonmagnetic to provide RF shielding for said telecoil.

10. The packaged telecoil assembly of claim 9, wherein said substrate has an electrically conductive ground plane having edges and sides, said cover is electrically connected to at least one of said edge and said sides of said ground plane.

11. The packaged telecoil assembly of claim 9, wherein said cover is composed of metal.

12. The packaged telecoil assembly of claim 9, wherein said cover is composed of stainless steel.

13. The packaged telecoil assembly of claim 9, wherein said cover is composed of brass.

14. The packaged telecoil assembly of claim 9, wherein said cover is composed of copper.

15. The packaged telecoil assembly of claim 9, further including a non-electrically conductive coating over said cover.

16. The packaged telecoil assembly of claim 15, wherein said non-electrically conductive coating temperature insulates said telecoil.

17. The packaged telecoil assembly of claim 15, further including a second metal coating over said non-electrically conductive coating on said cover.

18. The packaged telecoil assembly of claim 9, wherein said cover comprises a nonmagnetic metal portion electrically connected between two highly magnetic portions.

19. The packaged telecoil assembly of claim 1, wherein said cover comprises a non-electrically conductive material.

20. The packaged telecoil assembly of claim 19, wherein the cover is composed of plastic.

21. The packaged telecoil assembly of claim 20, wherein said plastic cover has an electrically conductive and at least partially nonmagnetic metal coating to provide RF shielding for said telecoil.

22. The packaged telecoil assembly of claim 21, wherein said metal coating is composed of gold.

23. The packaged telecoil assembly of claim 21, wherein said substrate has an electrically conductive ground plane having edges and sides, said metal coating is electrically connected to at least one of said edge and said sides of said ground plane.

24. The packaged telecoil assembly of claim 21, wherein said plastic cover has an outer surface, said metal coating abutting said outer surface of said plastic cover.

25. The packaged telecoil assembly of claim 21, wherein said plastic cover has an inner surface, said metal coating abutting said inner surface of said plastic cover.

26. The packaged telecoil assembly of claim 1, further including an ecapsulent beneath said cover encasing said telecoil.

27. The packaged telecoil assembly of claim 1, wherein said cover comprises an ecapsulent encasing said telecoil.

28. The packaged telecoil assembly of claim 27, wherein said ecapsulent is an epoxy.

29. The packaged telecoil assembly of claim 27, further including an electrically conductive and at least partially nonmagnetic metal coating over said cover to provide RF shielding for said telecoil.

30. The packaged telecoil assembly of claim 29, wherein said metal coating is composed of gold.

31. The packaged telecoil assembly of claim 29, wherein said substrate has an electrically conductive ground plane having edges and sides, said metal coating is electrically connected to said edges and said sides of said ground plane.

32. The packaged telecoil assembly of claim 1, further including a conformal protective material encasing said telecoil.

33. The packaged telecoil assembly of claim 32, further including an electrically conductive and at least partially nonmagnetic metal coating over said conformal protective material to provide RF shielding for said telecoil.

34. The packaged telecoil assembly of claim 33, wherein said cover comprises an ecapsulent encasing said metal coating.

35. The packaged telecoil assembly of claim 32, wherein said cover comprises an ecapsulent encasing said conformal protective material, said ecapsulent composed of an electrically conductive and at least partially nonmagnetic material to provide RF shielding for said telecoil.

36. The packaged telecoil assembly of claim 35, wherein said substrate has an electrically conductive ground plane having edges and sides, said ecapsulent is electrically connected to said edges and said sides of said ground plane.

37. The packaged telecoil assembly of claim 1, further including an integrated circuit capable of receiving a signal from said telecoil and at least two surface mount contacts, said integrated circuit connected to said substrate and enclosed by said cover, said contacts being on an exterior surface of said substrate, said contacts providing electric connections to said integrated circuit.

38. The packaged telecoil assembly of claim 1, further including at least two surface mount contacts, said contacts are positioned on an exterior surface of said substrate, said contacts providing electric connections to said telecoil.

39. The packaged telecoil assembly of claim 38, wherein said exterior surface includes a bottom surface.

40. The packaged telecoil assembly of claim 38, wherein said exterior surface includes a bottom and side surface.

41. The packaged telecoil assembly of claim 38, wherein said exterior surface includes a side surface.

42. The packaged telecoil assembly of claim 38, wherein said contacts are formed using a screen printing process and a metal alloy paste on said substrate.

43. The packaged telecoil assembly of claim 38, wherein said contacts are formed by etching an electrically conductive layer on said substrate.

44. The packaged telecoil assembly of claim 38, wherein said substrate comprises flex print board, said contacts formed by etching an electrically conductive layer on said flex print board.

45. The packaged telecoil assembly of claim 38, wherein said flex print board wraps around a portion of said cover.

46. The packaged telecoil assembly of claim 38, wherein said contacts are formed by connecting at least two metal tabs to said substrate.

47. A packaged telecoil assembly, comprising:

a telecoil that is induced by an external magnetic field to create an output signal corresponding to said magnetic field, said telecoil including a winding of wire with two lead ends for transmitting said output signal;

means for amplifying said output signal into an amplified output signal, said amplifying means being coupled to said two leads ends;

electrical contacts for transmitting said amplified output signal to external components; and

a cover enclosing said telecoil and said amplifying means.

48. The packaged telecoil assembly of claim 47, further including a substrate having an electrically conductive paths between a pair of input terminals and a pair of output terminals, said input terminals being connected to said two lead ends of said telecoil, said output terminals being connected to said amplifying means, said electrical contacts being mounted on said substrate.

49. The packaged telecoil assembly of claim 48, wherein said cover has one open end that is dimensioned to fit tightly around said substrate.

50. The packaged telecoil assembly of claim 48, wherein said electrical contacts are integrally formed within said substrate.

51. The packaged telecoil assembly of claim 47, wherein said cover includes a polymeric material.

52. The packaged telecoil assembly of claim 51, wherein said polymeric material is covered with a layer of metal.

53. The packaged telecoil assembly of claim 51, wherein said layer of metal is a material that provides RF shielding.

54. The packaged telecoil assembly of claim 47, wherein said cover includes an encapsulated material formed over said amplifier means and said telecoil.

55. The packaged telecoil assembly of claim 54, further including a metallic layer in said encapsulated material providing RF shielding.

56. The packaged telecoil assembly of claim 47, wherein said contacts are enlarged in comparison with standard size contacts.

57. The packaged telecoil assembly of claim 56, wherein said enlarged contacts have a 40% to 80% larger area than standard size contacts.

58. The packaged telecoil assembly of claim 47, further including an internal shield around said amplifying means and a conductive ground plane, said internal shield and said cover being connected to said ground plane.

59. The packaged telecoil assembly of claim 47, further including a conductive ground plane coupled to said cover, said ground plane forming part of a bypass filter for reducing noise from said output signal of said telecoil.

60. A method for shielding a telecoil assembly, comprising:

providing a telecoil that creates an output signal corresponding to an input magnetic field to which said telecoil is exposed and an amplifier that amplifies the output signal into an amplified output signal; and

enclosing said telecoil and said amplifier with a covering structure that is electrically conductive and has at least one portion that is non-magnetic.

61. The method of claim 60, wherein said step of enclosing includes molding an encapsulating material around said telecoil and said amplifier, said encapsulating material being a part of said covering structure.

62. The method of claim 61, wherein said step of enclosing further includes attaching a metal layer to said encapsulated material.

63. The method of claim 62, wherein said step of attaching a metal layer includes coating said encapsulating layer with a metallic material.

64. The method of claim 60, wherein said step of providing further includes providing a substrate that is attached to said telecoil and said amplifier.

65. The method of claim 64, wherein said step of enclosing includes attaching said covering structure to said substrate.

66. The method of claim 60, wherein said enclosing includes adding a conformal protective layer over said telecoil.

67. The method of claim 60, wherein said covering structure includes an inner layer of metal and an outer encapsulating layer.

68. The method of claim 60, wherein said step of providing includes providing a substrate on which said amplifier and said telecoil are mounted, said substrate including surface mount contacts for monitoring said amplified output signal.

69. A packaged telecoil assembly, comprising:

a telecoil that is induced by an external magnetic field to create an output signal corresponding to said magnetic field; and

a structure having surface mount contacts for transmitting said output signal.

70. The packaged telecoil assembly of claim 69, wherein said structure is a substrate on which said telecoil is mounted.

71. The packaged telecoil assembly of claim 70, wherein said surface mount contacts are formed using a screen printing process on said substrate.

72. The packaged telecoil assembly of claim 70, wherein said surface mount contacts are formed by etching an electrically conductive layer on said substrate.

73. The packaged telecoil assembly of claim 69, wherein said structure comprises a flex print board, said surface mount contacts formed by etching an electrically conductive layer on said flex print board.

74. The packaged telecoil assembly of claim 73, wherein said flex print board wraps around a portion of a cover that partially encompasses said telecoil.

75. The packaged telecoil assembly of claim 70, wherein said telecoil is generally cylindrical around a central axis and said structure has an exterior surface generally parallel to said central axis, said surface mount contacts being on said exterior surface.

76. The packaged telecoil assembly of claim 70, wherein said telecoil is generally cylindrical around a central axis and said structure has an exterior surface that is transverse to said central axis, said surface mount contacts being on said exterior surface.

77. The packaged telecoil assembly of claim 70, wherein said contacts are enlarged in comparison with standard size contacts.

78. The packaged telecoil assembly of claim 77, wherein said enlarged contacts have a 40% to 80% larger area than standard size contacts.

79. The packaged telecoil assembly of claim 70, further including an integrated circuit for processing said output signal, said integrated circuit being connected between said telecoil and said surface mount contacts.

80. A method of mounting a telecoil assembly in a hearing aid, the telecoil assembly including a telecoil that is induced by an external magnetic field to create an output signal corresponding to said external magnetic field, comprising:

providing a telecoil assembly that is packaged with a structure having surface mount contacts for transmitting an output signal from said telecoil; and

soldering said surface mount contacts to an intermediate assembly within said hearing aid.

81. The method of claim 80, wherein said surface mount contacts are enlarged surface mount contacts, and further including the step of adjusting a position of said telecoil assembly on said intermediate assembly in said hearing aid.

82. The method of claim 81, wherein said adjusting step occurs simultaneously with said soldering step.

83. The method of claim 81, wherein said adjusting step occurs after said soldering step.

84. The method of claim 81, wherein said enlarged surface mount contacts are about 40% to about 80% larger than standard size surface mount contacts.