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Tab surface treatments for polymer-metal laminate electrochemical cell packages

  • US 20030031926A1
  • Filed: 06/13/2002
  • Published: 02/13/2003
  • Est. Priority Date: 06/13/2001
  • Status: Abandoned Application
First Claim
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1. A method of making an electrochemical cell, comprising:

  • preparing a conductive metal lead including surface-treating a metal lead material to increase at least one of hydrophobicity and polymer adhesion of the lead material surfaces;

    preparing an electrochemical cell structure having said surface-treated conductive lead connected to an electrode and projecting from said structure;

    placing the electrochemical cell structure in a polymer-metal laminate cell package, said lead projecting from an opening in said package;

    optionally, interposing polymeric spacers between the lead and the polymer-metal laminate cell package; and

    sealing said electrochemical structure in the polymer-metal laminate package, whereby a hermetic seal between the electrochemical cell polymer-metal laminate packaging material, optional spacer, and surface-treated lead protruding from the package is formed.

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