Measuring apparatus

• US 20030032377A1
• Filed: 08/07/2002
• Published: 02/13/2003
• Est. Priority Date: 08/10/2001
• Status: Active Grant

• Current Assignee: Ebara Corporation
• Original Assignee: Ebara Corporation
• Inventors: Tada, Mitsuo, Suto, Yasunari
• Granted Patent: US 6,746,319 B2
• Time in Patent Office: Days
• US Class Current: 451/285
• CPC Class Codes: B24B 37/015 Temperature control
• CPC Class Codes: B24B 49/003 involving acoustic means
• CPC Class Codes: B24B 49/04 involving measurement of the workpiece at the place of grinding during grinding operation
• CPC Class Codes: B24B 49/10 involving electrical means B24B49/02, B24B49/08 take precedence
• CPC Class Codes: G01B 11/0666 using an exciting beam and a detection beam including surface acoustic waves [SAW]

Abstract

A measuring apparatus comprises a heating unit for applying heat to a first point within a workpiece or on a surface of a workpiece and propagating the heat to a second point within the workpiece or on the surface of the workpiece. The measuring apparatus further comprises a measuring unit for measuring a displacement of the surface of the workpiece at the second point to which the heat has been propagated, and an analyzing unit for analyzing a structure of the workpiece based on the displacement measured by the measuring unit in consideration of a distance between the first point and the second point.

Claims

1. A measuring apparatus comprising:

a heating unit for applying heat to a first point within a workpiece or on a surface of a workpiece and propagating the heat to a second point within the workpiece or on the surface of the workpiece;

a measuring unit for measuring a displacement of the surface of the workpiece at said second point to which said heat has been propagated; and

an analyzing unit for analyzing a structure of said workpiece based on the displacement measured by said measuring unit in consideration of a distance between said first point and said second point.

2. A measuring apparatus comprising:

a strain applying unit for applying a strain to a first point within a workpiece or on a surface of a workpiece and propagating the strain to a second point within the workpiece or on the surface of the workpiece;

a measuring unit for measuring a displacement of the surface of the workpiece at said second point to which said strain has been propagated; and

an analyzing unit for analyzing a structure of said workpiece based on the displacement measured by said measuring unit in consideration of a distance between said first point and said second point.

3. A measuring apparatus according to claim 2, wherein said strain applying unit utilizes a sound wave to apply the strain to said first point.

4. A measuring apparatus according to claim 2, wherein said strain applying unit utilizes an ultrasonic wave to apply the strain to said first point.

5. A measuring apparatus according to claim 2, wherein said strain applying unit utilizes an electromagnetic wave to apply the strain to said first point.

6. A polishing apparatus comprising:

a polishing table having a polishing surface;

a top ring for holding and pressing a workpiece to be polished against said polishing surface; and

a measuring apparatus for measuring the thickness of a film formed on a surface of the workpiece, said measuring apparatus comprising;

a heating unit for applying heat to a first point within the workpiece or on the surface of the workpiece and propagating the heat to a second point within the workpiece or on the surface of the workpiece;

a measuring unit for measuring a displacement of the surface of the workpiece at said second point to which said heat has been propagated; and

an analyzing unit for analyzing a structure of said workpiece based on the displacement measured by said measuring unit in consideration of a distance between said first point and said second point.

7. A polishing apparatus comprising:

a polishing table having a polishing surface;

a top ring for holding and pressing a workpiece to be polished against said polishing surface; and

a measuring apparatus for measuring the thickness of a film formed on a surface of the workpiece, said measuring apparatus comprising;

a strain applying unit for applying a strain to a first point within the workpiece or on the surface of the workpiece and propagating the strain to a second point within the workpiece or on the surface of the workpiece;

a measuring unit for measuring a displacement of the surface of the workpiece at said second point to which said strain has been propagated; and

an analyzing unit for analyzing a structure of said workpiece based on the displacement measured by said measuring unit in consideration of a distance between said first point and said second point.

8. A polishing apparatus according to claim 7, wherein said strain applying unit utilizes a sound wave to apply the strain to said first point.

9. A polishing apparatus according to claim 7, wherein said strain applying unit utilizes an ultrasonic wave to apply the strain to said first point.

10. A polishing apparatus according to claim 7, wherein said strain applying unit utilizes an electromagnetic wave to apply the strain to said first point.