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Multilayer board in which wiring of signal line that requires tamper-resistance is covered by component or foil, design apparatus, method, and program for the multilayer board, and medium recording the program

  • US 20030033108A1
  • Filed: 12/20/2001
  • Published: 02/13/2003
  • Est. Priority Date: 01/10/2001
  • Status: Active Grant
First Claim
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1. A multilayer board, comprising a signal line requiring tamper-resistance, the signal line including:

  • (a) a conductive trace and (b) a conductive via that passes through layers of the multilayer board, wherein the conductive trace and an end of the conductive via existing on an outside layer of the multilayer board are placed under one or more circuit components mounted on the outside layer.

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