Dielectric resonator, dielectric filter and method of producing the same, filter device combined to a transmit-receive antenna and communication apparatus using the same

• US 20030034124A1
• Filed: 06/19/2002
• Published: 02/20/2003
• Est. Priority Date: 06/19/2001
• Status: Abandoned Application

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Nakatani, Seiichi, Maekawa, Tomoya, Sugaya, Yasuhiro, Yamada, Toru
• Application Number:
  US10/173,729
• Publication Number:
  US 20030034124A1
• Time in Patent Office: Days
• US Class Current: 156/291
• CPC Class Codes: H01P 1/20345 Multilayer filters
• CPC Class Codes: H01P 11/007 Manufacturing frequency-selective devices resonators H01P11/008
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing

Abstract

There is provided a dielectric resonator including a pair of dielectric substrates opposed to each other and resonator electrodes disposed between the pair of dielectric substrate, wherein the resonator electrodes are disposed so as to be brought into contact with major surfaces of the pair of dielectric substrates, and a bonding layer is disposed around the resonator electrodes so as to bond the pair of dielectric substrates. The pair of dielectric substrates have been in advance sintered at sufficiently high temperature which is a dielectric having an fQ value at 1 GHz in the range of 3×103 to 1×10⁵, then achieve a high Q value as a filter. The pair of the substrates are provided with the surface roughness of a range of 0.1 to 2.0 μm, and flatness of 10 μm or less between both ends thereof to bring the resonant electrodes in close contact with the surfaces of the substrate. Such ceramic filters are used comfortably for a filter connecting a transmit-receive antenna to a transmitter and receiver, which can provide communication equipment having a good high frequency performance for cellular telephone systems.

Claims

1. A dielectric resonator including a pair of dielectric substrates opposed to each other and resonator electrodes disposed between the pair of dielectric substrate, wherein the resonator electrodes are disposed so as to be brought into direct contact with major surfaces of the pair of dielectric substrates, and a bonding layer is disposed around the resonator electrodes so as to bond the pair of dielectric substrates.

2. The dielectric resonator according to claim 1, wherein the pair of dielectric substrates comprise a dielectric having an fQ value at 1 GHz in the range of 3×

10³ to 1×

10⁵.

3. The dielectric resonator according to claim 1, wherein the pair of dielectric substrates comprise a Zr—

Ti—

Mg—

Nb—

O, Bi—

Nb—

O, Ba—

Ti—

O, Ba—

Nd—

Ti—

O or Ba—

Sm—

Ti—

O based dielectric ceramic.

4. The dielectric resonator according to claim 1, wherein the pair of dielectric substrates have the surface roughness of a range of 0.1 to 2.0 μ

m, and flatness of 10 μ

m or less between both ends thereof.

5. The dielectric resonator according to claim 1, wherein the resonator electrodes are of a foil of one selected from copper, silver and a metal containing either one of these as a main component.

6. The dielectric resonator according to claim 1, wherein the resonator electrodes comprise striplines.

7. The dielectric resonator according to claim 1, wherein the resonator electrodes comprise a layer formed by curing a conductive paste containing a metal powder and an organic binder, the metal powder being of one kind selected from copper, silver and a metal containing either one of these as a main component.

8. The dielectric resonator according to claim 1, wherein the resonator electrodes are striplines, and the open end portions of the striplines include wide portions.

9. The dielectric resonator according to claim 1, wherein the resonator electrodes have a thickness of 50 to 400 μ

m.

10. The dielectric resonator according to claim 1, wherein the bonding layer is made of a composite material containing a thermosetting resin and an inorganic filler.

11. The dielectric resonator according to claim 1, wherein the bonding layer has lower permittivity than ¼

times the permittivity of the dielectric substrate.

21. A dielectric filter, comprising the resonator electrodes of the dielectric resonator according to claim 1 which are a pair of striplines coupled to each other by an electromagnetic field, an interstage coupling capacitor electrode which is embedded in either one of the dielectric substrates and electrostatically couples the pair of striplines, and an input/output coupling capacitor electrodes which are embedded in the other dielectric substrate and are coupled to input/output ends of the striplines.

12. A method of producing a dielectric resonator comprising steps of:

facing the main surfaces of a pair of dielectric substrates sintered from a dielectric opposed to each other;

interposing resonator electrodes made of a metal foil therebetween and integrally bonding these; and

filling a space around the resonator electrodes between the pair of dielectric substrates with an adhesive and curing the adhesive by heating to form a bonding layer.

19. The method of producing a dielectric resonator according to any one of claims 12 to 14, the method further comprises a step of laminating a plurality of dielectric ceramic green sheets into a laminate and firing the laminate to form a dielectric substrate.

13. A method of producing a dielectric resonator comprising steps of:

printing a pattern of an adhesive to be used as a bonding layer on a main surface of one dielectric substrate sintered from a dielectric except for regions in which resonator electrodes are to be formed;

curing the adhesive in a B stage and printing a conductive paste to be used as resonator electrodes in the regions in which the resonator electrodes are to be formed; and

placing a main surface of the other dielectric substrate sintered from a dielectric on the surface of the dielectric substrate on which the adhesive is provided, applying pressure while heating to the pair of dielectric substrates to completely cure the adhesive from a B stage and the conductive paste so that the pair of dielectric substrates, the bonding layer and the resonator electrode are integrally bonded.

14. A method of producing a dielectric resonator comprising steps of:

forming an electrode carrier film composed of a resin sheet provided with punched portions each having a shape larger than the shape of a resonator electrode and resonator electrodes which are made of a metal foil and inserted into the punched portions;

interposing the electrode carrier film between a pair of dielectric substrates obtained by sintering a dielectric while their one main surfaces are opposed to each other;

applying pressure and heat to the pair of dielectric substrates to completely cure the resin sheet and thereby form a bonding layer so that the pair of dielectric substrates, the resonator electrodes and the bonding layer are integrally laminated; and

cutting the laminate to separate into dielectric resonators.

15. The method of producing a dielectric resonator according to claim 14, wherein the resonator electrodes carried on the electrode carrier film are interposed between a large number of pairs of dielectric substrates in the step of interposing the electrode carrier film;

and

the resin sheet is cut between the adjacent dielectric substrates in the laminate in the separating step.

16. The method of producing a dielectric resonator according to claim 14, wherein the electrode carrier film is interposed between the pair of dielectric substrates in the step of interposing the electrode carrier film;

and

the laminate of the dielectric substrates is cut between adjacent resonator electrodes in the separating step.

17. The method of producing a dielectric resonator according to claim 14, which includes a step of forming an external electrode on an outer surface of the dielectric resonator.

18. The method of producing a dielectric resonator according to claim 17, wherein the external electrode is formed by metal plating in the step of forming the external electrode.

20. The method of producing a dielectric resonator according to claim 14, which the method further comprises a step of forming the external electrode on the other main surface of the pair of dielectric substrates in advance.

23. A filter for a transmit-receive antenna, using tow of the dielectric filters according to claim 18 as a transmitting filter and a receiving filter.

24. Communication equipment using the filter for a transmit-receive antenna according to claim 23, wherein the filter connects the antenna to a transmitter and receiver.

22. A method of producing a dielectric filter comprising steps of:

disposing an interstage coupling capacitor electrode between two dielectric ceramic green sheets laminated in a predetermined thickness and sintering these to form a dielectric substrate;

disposing an input/output coupling capacitor electrodes between another pair of dielectric ceramic green sheets similarly laminated in a predetermined thickness and sintering these to form a dielectric substrate;

interposing resonator electrodes between the dielectric substrate including the interstage coupling capacitor and the dielectric substrate including the input/output coupling capacitors;

filling a thermosetting resin adhesive around the resonator electrodes in a space between both the substrates; and

applying pressure while heating to both the dielectric substrates to cure the adhesive and thereby form a bonding layer, integrating the dielectric substrates with the resonator electrodes.