Light emitting device and method of manufacturing the same
First Claim
1. A light emitting device comprising:
- a first substrate;
a second substrate;
a light emitting element formed between the first substrate and the second substrate;
a plurality of first insulating films formed between the first substrate and the light emitting element;
at least one second insulating film formed in each space between the plurality of first insulating films;
a plurality of third insulating films formed between the second substrate and the light emitting element; and
at least one fourth insulating film formed in each space between the plurality of third insulating films, wherein the first substrate and the second substrate are formed of plastic, and wherein the at least one second insulating film has a smaller stress than that of each of the plurality of first insulating films and the at least one fourth insulating film has a smaller stress than that of each of the plurality of third insulating films.
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Accused Products
Abstract
The present invention has an object of providing a light emitting device including an OLED formed on a plastic substrate, which can prevent the degradation due to penetration of moisture or oxygen. On a plastic substrate, a plurality of films for preventing oxygen or moisture from penetrating into an organic light emitting layer in the OLED (hereinafter, referred to as barrier films) and a film having a smaller stress than that of the barrier films (hereinafter, referred to as a stress relaxing film), the film being interposed between the barrier films, are provided. Owing to a laminate structure of a plurality of barrier films, even if a crack occurs in one of the barrier films, the other barrier film(s) can effectively prevent moisture or oxygen from penetrating into the organic light emitting layer. Moreover, the stress relaxing film, which has a smaller stress than that of the barrier films, is interposed between the barrier films, thereby making it possible to reduce a stress of the entire sealing film. As a result, a crack due to stress hardly occurs.
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Citations
102 Claims
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1. A light emitting device comprising:
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a first substrate;
a second substrate;
a light emitting element formed between the first substrate and the second substrate;
a plurality of first insulating films formed between the first substrate and the light emitting element;
at least one second insulating film formed in each space between the plurality of first insulating films;
a plurality of third insulating films formed between the second substrate and the light emitting element; and
at least one fourth insulating film formed in each space between the plurality of third insulating films, wherein the first substrate and the second substrate are formed of plastic, and wherein the at least one second insulating film has a smaller stress than that of each of the plurality of first insulating films and the at least one fourth insulating film has a smaller stress than that of each of the plurality of third insulating films. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A light emitting device comprising:
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a first substrate;
a second substrate;
a light emitting element and a thin film transistor, formed between the first substrate and the second substrate;
a plurality of first insulating films formed between the first substrate, and the light emitting element and the thin film transistor;
at least one second insulating film formed in each space between the plurality of first insulating films;
a plurality of third insulating films formed between the second substrate, and the light emitting element and the thin film transistor; and
at least one fourth insulating film formed in each space between the plurality of third insulating films, wherein the first substrate and the second substrate are formed of plastic, and wherein the at least one second insulating film has a smaller stress than that of each of the plurality of first insulating films; and
the at least one fourth insulating film has a smaller stress than that of each of the plurality of third insulating films. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A light emitting device comprising:
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a substrate;
a light emitting element;
a plurality of first insulating films formed between the substrate and the light emitting element;
at least one second insulating film formed in each space between the plurality of first insulating films;
a plurality of third insulating films; and
at least one fourth insulating film formed in each space between the plurality of third insulating films, wherein the light emitting element is formed between the plurality of third insulating films and the substrate, wherein the substrate is formed of plastic, and wherein the at least one second insulating film has a smaller stress than that of each of the plurality of first insulating films and the at least one fourth insulating film has a smaller stress than that of each of the plurality of third insulating films. - View Dependent Claims (14, 15, 16, 17, 18)
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19. A light emitting device comprising:
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a substrate;
a light emitting element and a thin film transistor;
a plurality of first insulating films formed between the substrate, and the light emitting element and the thin film transistor;
at least one second insulating film formed in each space between the plurality of first insulating films;
a plurality of third insulating films; and
at least one fourth insulating film formed in each space between the plurality of third insulating films, wherein the light emitting element and the thin film transistor are formed between the plurality of third insulating films and the substrate, wherein the substrate is formed of plastic, and wherein the at least one second insulating film has a smaller stress than that of each of the plurality of first insulating films and the at least one fourth insulating film has a smaller stress than that of each of the plurality of third insulating films. - View Dependent Claims (20, 21, 22, 23, 24)
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25. A light emitting device comprising:
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a first substrate;
a second substrate;
a light emitting element formed between the first substrate and the second substrate;
a plurality of first insulating films formed between the first substrate and the light emitting element;
at least one second insulating film formed in each space between the plurality of first insulating films;
a first bonding layer formed between the first substrate and the plurality of first insulating films;
a plurality of third insulating films formed between the second substrate and the light emitting element;
at least one fourth insulating film formed in each space between the plurality of third insulating films; and
a second bonding layer formed between the second substrate and the plurality of third insulating films, wherein the first substrate and the second substrate are formed of plastic, and wherein the at least one second insulating film has a smaller stress than that of each of the plurality of first insulating films and the at least one fourth insulating film has a smaller stress than that of each of the plurality of third insulating films. - View Dependent Claims (26, 27, 28, 29, 30)
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31. A method of manufacturing a light emitting device, comprising:
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forming a first bonding layer over a first substrate;
forming a first insulating film over the first bonding layer;
forming a light emitting element and a thin film transistor over the first insulating film;
forming a second insulating film so as to cover the light emitting element and the thin film transistor;
bonding a plurality of fourth insulating films included in a second substrate and the second insulating film to each other through a second bonding layer, the plurality of fourth insulating films interposing at least one third insulating film therebetween;
removing the first substrate and exposing the first insulating film by removing the first bonding layer; and
bonding a plurality of sixth insulating films included in a third substrate and the first insulating film to each other through a third bonding layer, the plurality of sixth insulating films interposing at least one fifth insulating film therebetween, wherein the second substrate and the third substrate are formed of plastic, and wherein the at least one third insulating film has a smaller stress than that of each of the plurality of fourth insulating films and the at least one fifth insulating film has a smaller stress than that of each of the plurality of sixth insulating films. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42)
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43. A method of manufacturing a light emitting device, comprising:
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forming a first bonding layer over a first substrate;
forming a first insulating film over the first bonding layer;
forming a light emitting element, a thin film transistor and a wiring on the first insulating film;
forming a second insulating film so as to cover the light emitting element, the thin film transistor and the wiring;
bonding a plurality of fourth insulating films included in a second substrate and the second insulating film to each other through a second bonding layer, the plurality of fourth insulating films interposing at least one third insulating film therebetween;
removing the first substrate and exposing the first insulating film by removing the first bonding layer;
bonding a plurality of sixth insulating films included in a third substrate and the first insulating film to each other through a third bonding layer, the plurality of sixth insulating films interposing at least one fifth insulating film therebetween; and
partially removing the second substrate, the second insulating film, the at least one third insulating film, the plurality of fourth insulating films and the second bonding layer to partially expose the wiring, so that a part of the wiring and a terminal included in an FPC are electrically connected to each other by using a conductive resin having anisotropy, wherein the second substrate and the third substrate are formed of plastic, and wherein the at least one third insulating film has a smaller stress than that of each of the plurality of fourth insulating films and the at least one fifth insulating film has a smaller stress than that of each of the plurality of sixth insulating films. - View Dependent Claims (44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54)
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55. A method of manufacturing a light emitting device, comprising:
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forming a first bonding layer over a first substrate;
forming a first insulating film over the first bonding layer;
forming a light emitting element, a thin film transistor and a wiring over the first insulating film;
forming a second insulating film so as to cover the light emitting element, the thin film transistor and the wiring;
bonding a plurality of fourth insulating films included in a second substrate and the second insulating film to each other through a second bonding layer, the plurality of fourth insulating films interposing at least one third insulating film therebetween;
removing the first substrate and exposing the first insulating film by removing the first bonding layer;
bonding a plurality of sixth insulating films included in a third substrate and the first insulating film to each other through a third bonding layer, the plurality of sixth insulating films interposing at least one fifth insulating film therebetween; and
partially removing the third substrate, the first insulating film, the at least one fifth insulating film, the plurality of sixth insulating films and the third bonding layer to partially expose the wiring, so that a part of the wiring and a terminal included in an FPC are electrically connected to each other by using a conductive resin having anisotropy, wherein the second substrate and the third substrate are formed of plastic, and wherein the at least one third insulating film has a smaller stress than that of each of the plurality of fourth insulating films and the at least one fifth insulating film has a smaller stress than that of each of the plurality of sixth insulating films. - View Dependent Claims (56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66)
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67. A method of manufacturing a light emitting device, comprising:
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forming a first bonding layer over a first substrate;
forming a first insulating film over the first bonding layer;
forming a light emitting element and a thin film transistor over the first insulating film;
forming a second insulating film so as to cover the light emitting element and the thin film transistor;
bonding a second substrate and the second insulating film to each other through a second bonding layer;
removing the first substrate and exposing the first insulating film by removing the first bonding layer;
bonding a plurality of fourth insulating films included in a third substrate and the first insulating film to each other through a third bonding layer, the plurality of fourth insulating films interposing at least one third insulating film therebetween;
removing the second substrate and exposing the second insulating film by removing the second bonding layer; and
forming a plurality of sixth insulating films interposing at least one fifth insulating film therebetween, the plurality of sixth insulating films being in contact with the second insulating film, wherein the third substrate is formed of plastic, and wherein the at least one third insulating film has a smaller stress than that of each of the plurality of fourth insulating films and the at least one fifth insulating film has a smaller stress than that of each of the plurality of sixth insulating films. - View Dependent Claims (68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78)
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79. A method of manufacturing a light emitting device, comprising:
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forming a first bonding layer on a first substrate;
forming a first insulating film on the first bonding layer;
forming a light emitting element, a thin film transistor and a wiring on the first insulating film;
forming a second insulating film so as to cover the light emitting element, the thin film transistor and the wiring;
bonding a second substrate and the second insulating film to each other through a second bonding layer;
removing the first substrate and exposing the first insulating film by removing the first bonding layer;
bonding a plurality of fourth insulating films included in a third substrate and the first insulating film to each other through a third bonding layer, the plurality of fourth insulating films interposing at least one third insulating film therebetween;
removing the second bonding layer so as to remove the second substrate to expose the second insulating film;
forming a plurality of sixth insulating films interposing at least one fifth insulating film therebetween, the plurality of sixth insulating films being in contact with the second insulating film; and
partially removing the second insulating film, the at least one fifth insulating film and the plurality of sixth insulating films to partially expose the wiring, so that a part of the wiring and a terminal included in an FPC are electrically connected to each other by using a conductive resin having anisotropy, wherein the third substrate is formed of plastic, and wherein the at least one third insulating film has a smaller stress than that of each of the plurality of fourth insulating films and the at least one fifth insulating film has a smaller stress than that of each of the plurality of sixth insulating films. - View Dependent Claims (80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90)
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91. A method of manufacturing a light emitting device, comprising:
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forming a first bonding layer on a first substrate;
forming a first insulating film over the first bonding layer;
forming a light emitting element, a thin film transistor and a wiring on the first insulating film;
forming a second insulating film so as to cover the light emitting element, the thin film transistor and the wiring;
bonding a second substrate and the second insulating film to each other through a second bonding layer;
removing the first substrate and exposing the first insulating film by removing the first bonding layer;
bonding a plurality of fourth insulating films included in a third substrate and the first insulating film to each other through a third bonding layer, the plurality of fourth insulating films interposing at least one third insulating film therebetween;
removing the second substrate and exposing the second insulating film by removing the second bonding layer;
forming a plurality of sixth insulating films interposing at least one fifth insulating film therebetween, the plurality of sixth insulating films being in contact with the second insulating film; and
partially removing the third substrate, the first insulating film, the at least one third insulating film, the plurality of fourth insulating films and the third bonding layer to partially expose the wiring, so that a part of the wiring and a terminal included in an FPC are electrically connected to each other by using a conductive resin having anisotropy, wherein the third substrate is formed of plastic, and wherein the at least one third insulating film has a smaller stress than that of each of the plurality of fourth insulating films and the at least one fifth insulating film has a smaller stress than that of each of the plurality of sixth insulating films. - View Dependent Claims (92, 93, 94, 95, 96, 97, 98, 99, 100, 101, 102)
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Specification