Chip alignment and placement apparatus for integrated circuit, MEMS, photonic or other devices
First Claim
Patent Images
1. A method of processing semiconductor chips for integrated circuit, MEMS or photonic device manufacture comprising:
- a) at least partly severing a wafer of semiconductor material in at least one dimension to provide at least one parting line;
b) completely severing the wafer in a dimension perpendicular to the at least one parting line to form one or more linear chip aggregations composed of partially joined individual chips, each linear chip aggregation being separated by one or more severed edges of the individual chips;
c) aligning the one or more linear chip aggregations with reception sites on a substrate;
d) dispensing individual chips from the one or more linear chip aggregations onto the reception sites by severing a single chip from each linear chip aggregation and contacting it with the surface of the substrate while simultaneously preserving its linear orientation and controlling its alignment on the surface of the substrate.
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Abstract
Devices for manipulating, receiving and dispensing diced semiconductor materials, in which the semiconductor material is diced to provide partially connected dice in linear aggregations.
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Citations
23 Claims
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1. A method of processing semiconductor chips for integrated circuit, MEMS or photonic device manufacture comprising:
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a) at least partly severing a wafer of semiconductor material in at least one dimension to provide at least one parting line;
b) completely severing the wafer in a dimension perpendicular to the at least one parting line to form one or more linear chip aggregations composed of partially joined individual chips, each linear chip aggregation being separated by one or more severed edges of the individual chips;
c) aligning the one or more linear chip aggregations with reception sites on a substrate;
d) dispensing individual chips from the one or more linear chip aggregations onto the reception sites by severing a single chip from each linear chip aggregation and contacting it with the surface of the substrate while simultaneously preserving its linear orientation and controlling its alignment on the surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of manufacturing an integrated circuit device comprising:
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a) preparing a receiving substrate;
b) separating a wafer of semiconductor material into one or more linear chip aggregations;
c) aligning the one or more linear chip aggregations with reception sites on a receiving substrate; and
d) severing a single chip from each one or more linear chip aggregation and contacting it with the reception site while simultaneously preserving the linear orientation and controlling the alignment of said chip; and
e) disposing the chip onto one or more devices selected from antennae, contacts, circuits or electrodes on the receiving substrate. - View Dependent Claims (12, 13, 14)
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15. A stapler apparatus for dispensing diced semiconductor materials on a substrate, comprising:
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a) one or more chambers for receiving and holding one or more linear chip aggregations; and
b) a dispensing device that releases individual chips from the one or more linear chip aggregations held within said chambers onto reception sites on a substrate. - View Dependent Claims (16, 17, 18, 19, 20)
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21. A rotary magazine for receiving and dispensing linear aggregations of diced semiconductor chips comprising at least one sleeve surrounding a core cylinder;
- and a series of chambers on the interior or exterior of the at least one sleeve, each chamber accommodating one or a series of linear aggregations of semiconductor chips therein.
- View Dependent Claims (22)
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23. A flat magazine for receiving and dispensing linear aggregations of diced semiconductor chips comprising a chamber having a loading end and a dispensing end, the loading end being in communicable relation to a first tamping means, and the dispensing end being in communicable relation to a second tamping means.
Specification