Low dielectric constant etch stop films
First Claim
1. A method of fabricating an integrated circuit device, the method comprising:
- depositing a layer of amorphous material comprising silicon, carbon, nitrogen, and hydrogen by chemical vapor deposition on a substrate, the substrate comprising regions of metal conductor and regions of insulating material;
depositing a layer of insulating material on the amorphous layer; and
etching patterns in the layer of insulating material wherein the amorphous layer etches at a slower rate than the layer of insulating material.
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Abstract
An amorphous material containing silicon, carbon, hydrogen and nitrogen, provides a barrier/etch stop layer for use with low dielectric constant insulating layers and copper interconnects. The amorphous material is prepared by plasma assisted chemical vapor deposition (CVD) of alklysilanes together with nitrogen and ammonia. Material that at the same time has a dielectric constant less than 4.5, an electrical breakdown field about 5 MV/cm, and a leakage current less than or on the order of 1 nA/cm2 at a field strength of 1 MV/cm has been obtained. The amorphous material meets the requirements for use as a barrier/etch stop layer in a standard damascene fabrication process.
19 Citations
29 Claims
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1. A method of fabricating an integrated circuit device, the method comprising:
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depositing a layer of amorphous material comprising silicon, carbon, nitrogen, and hydrogen by chemical vapor deposition on a substrate, the substrate comprising regions of metal conductor and regions of insulating material;
depositing a layer of insulating material on the amorphous layer; and
etching patterns in the layer of insulating material wherein the amorphous layer etches at a slower rate than the layer of insulating material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An integrated circuit device comprising:
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a first level substrate comprising regions of metal conductor and regions of insulating material;
a layer of amorphous material comprising silicon, carbon, nitrogen, and hydrogen overlying the substrate; and
a second level layer of insulating material overlying the layer of amorphous material, wherein the amorphous material etches at a rate that is slower than the rate at which the layer of insulating material etches. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A method of producing an etch stop layer on a substrate, the method comprising:
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introducing the substrate into a reactor;
providing a flow of process gases comprising an alkylsilane, nitrogen, and ammonia to the reactor wherein the ratio of the sum of the flow rate of nitrogen and ammonia to the flow rate of alkylsilane is between about 0.25;
1 and about 2.75;
1;
producing a plasma condition in the reactor wherein reaction of the process gases results in deposition of the etch stop layer on the substrate. - View Dependent Claims (24, 25, 26, 27, 28, 29)
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Specification