Organic packages having low tin solder connections

• US 20030037959A1
• Filed: 06/28/2002
• Published: 02/27/2003
• Est. Priority Date: 12/21/1999
• Status: Active Grant

• Current Assignee: Advanced Micro Devices, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Anderson, Charles, Guardado, Maria, Khan, Mohammed Zubair, Master, Raj N.
• Granted Patent: US 6,812,570 B2
• Time in Patent Office: Days
• US Class Current: 174/256
• CPC Class Codes: H01L 2224/10 Bump connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/13111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 23/145 Organic substrates, e.g. plastic
• CPC Class Codes: H01L 23/49883 the conductive materials containing organic materials or pastes, e.g. for thick films for printed circuits H05K1/092
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/0105 Tin [Sn]
• CPC Class Codes: H01L 2924/01051 Antimony [Sb]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/01327 Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H05K 3/3463 : Solder compositions in relation to features of the printed circuit board or the mounting process
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 428/24917 : including metal layer

Abstract

An organic carrier member for mounting a semiconductor device is provided that has a plurality of solder pads containing low amounts of tin and bismuth. Embodiments include a bismaleimide-triazine epoxy laminate having a plurality of solder pads on the surface thereof where the solder pads contain no more than about 20 weight percent tin and has a reflow temperature of no greater than about 270° C.

Claims

1. A carrier member suitable for mounting a semiconductor device, the member comprising:

an organic substrate having a surface;

a plurality of solder pads on the surface of the organic substrate for directly receiving a semiconductor device to be mounted thereto, wherein the solder pads comprises no more than about 20 wt. % tin and have a reflow temperature of no greater than about the decomposition temperature of the organic substrate; and

a plurality of electrical connections on the organic substrate which are in electrical communication with the solder pads on the surface of the organic substrate.

2. The carrier member of claim 1, wherein the solder pads comprise between about 2 wt. % to about 16 wt. % bismuth.

3. The carrier member of claim 1, wherein the solder pads comprise about 85 wt. % to about 65 wt. % lead, about 12 wt. % to about 6 wt. % antimony, about 10 wt. % to about 3 wt. % tin and about 2 wt. % to about 15 wt. % bismuth.

4. The carrier member of claim 3, wherein the organic substrate is a laminated structure and the electrical connections are in the form of pins.

5. The carrier member of claim 1, wherein the solder pads have a reflow temperature that is lower by at least 5°

C. than the reflow temperature of any other soldered joins on the substrate.

6. The carrier member of claim 1, wherein the solder pads comprise about 70 wt. % tin, about 8 wt. % antimony, about 10 wt. % tin and about 12 wt. % bismuth.

16. A device assembly, the assembly comprising:

the carrier member of claim 1;

and

a semiconductor device having a plurality of solderable conductive contacts thereon, wherein the solderable conductive contacts of the semiconductor device are in electrical communication with the carrier member through the solder pads on the substrate.

17. The device assembly of claim 16, wherein the solderable contacts comprise solder bumps.

18. The device assembly of claim 16, wherein the device is an integrated circuit die.

19. A method of manufacturing a device assembly, the method comprising:

aligning a semiconductor device having a plurality of solderable conductive contacts thereon with the carrier member of claim 1 such that the solderable conductive contacts of the semiconductor device are aligned with the solder pads on the surface of the organic substrate; and

forming an electrical connection between the solderable conductive contacts of the semiconductor device and the carrier member to form the device assembly.

20. The method of claim 19 comprising reflowing the solder pads on the carrier member by heating the carrier member from about 190°

C. to about 270°

C.

7. A carrier member for mounting a device, the member comprising:

an organic substrate having a top surface and a bottom surface;

a plurality of solder pads on the top surface of the organic substrate for directly receiving the device to be mounted thereto, wherein the solder pads comprises no more than about 20 wt. % tin and have a reflow temperature of no greater than about the decomposition temperature of the organic substrate; and

a plurality of electrical connections on the bottom surface of the organic substrate which are in electrical communication with the solder pads on the top surface of the organic substrate.

8. The carrier member of claim 7, wherein the solder pads comprise no more than about 10 wt. % tin.

9. The carrier member of claim 7, wherein the solder pads comprise about 85 wt. % to about 82 wt. % lead, about 12 wt. % to about 8 wt. % antimony, about 10 wt. % to about 3 wt. % tin and up to about 5 wt. % silver.

10. The carrier member of claim 7, wherein the reflow temperature of the solder pads is no greater than about 270°

C.

11. The carrier member of claim 7, wherein the organic substrate comprises a laminated structure or a molded plastic.

12. The carrier member of claim 7, wherein the organic substrate comprises polyphenylene sulfide, polysulphone, polyethersulphone, polyarylsulphone, phenol, polyamide, bismaleimide-triazine, epoxy or mixtures thereof.

13. The carrier member of claim 7, wherein the electrical connections are in the form of metallized contacts, solder balls, or pins.

14. A carrier member for mounting a bumped die, the member comprising:

a substrate comprising a bismaleimide-triazine epoxy laminate having a surface;

a plurality of solder pads on the surface of the substrate for directly receiving a bumped die to be mounted thereto, wherein the solder pads comprise no more than about 20 wt. % tin; and

a plurality of electrical connections on the substrate which are in electrical communication with the solder pads on the surface of the substrate.

15. The carrier member of claim 14, wherein the solder pads further comprise arsenic, lead, and from about 2 wt. % to about 16 wt. % bismuth and wherein the electrical connections are in the form pins.