SUBSTRATE MAPPING
First Claim
1. A mounting substrate assembly comprising:
- a substrate having a first surface and a second surface, at least one of said first surface and said second surface including a plurality of pretested die sites, each of said pretested die sites categorized as at least one of a defective die site and a good die site;
at least one pretested defective die and at least one pretested good die configured to attach to said pretested die sites, said at least one pretested defective die attached to each of said defective die sites and said at least one pretested good die attached to each of said good die sites.
1 Assignment
0 Petitions
Accused Products
Abstract
A method and apparatus relating to fabricating semiconductor die packages including a mounting substrate and dice attached thereto. The mounting substrate includes multiple die attach sites and a designator having substrate identification information. The die attach sites are evaluated and categorized as either good or defective die attach sites, wherein the evaluated information is saved in an electronic file as mapped information. A die attach apparatus attaches dice to the die attach sites in accord with the mapped information, wherein known good dice are attached to the good die attach sites and known defective dice are attached to the defective die attach sites. The assembly is then encapsulated in a transfer molding operation. Since each die attach site includes a die attached thereto, the structural integrity of the mounting substrate is maintained and there is greater volume control of encapsulation material in the transfer molding operation to prevent waste and shortage of the encapsulation material. The assembly may then be segregated into individual semiconductor die packages, in which the defective die packages having the defective dice and defective die attach sites are discarded in accord with the mapped information.
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Citations
46 Claims
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1. A mounting substrate assembly comprising:
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a substrate having a first surface and a second surface, at least one of said first surface and said second surface including a plurality of pretested die sites, each of said pretested die sites categorized as at least one of a defective die site and a good die site;
at least one pretested defective die and at least one pretested good die configured to attach to said pretested die sites, said at least one pretested defective die attached to each of said defective die sites and said at least one pretested good die attached to each of said good die sites. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A system for assembling a semiconductor package, the system comprising:
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a mounting substrate having a plurality of die attach sites on at least one surface thereof;
a reading unit coupled to an electronic file having mapped information of said mounting substrate, said mapped information including locations on said mounting substrate of good die attach sites and defective die attach sites;
an attachment apparatus coupled to said reading unit and said electronic file, at least one of said reading unit and said electronic file providing said mapped information to said attachment apparatus, said attachment apparatus selectively attaching good dice to said good die attach sites and selectively attaching defective dice to said defective die attach sites in accord with said mapped information. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26)
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27. A system for fabricating semiconductor packages, the system comprising:
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a substrate testing station configured to test a mounting substrate having a plurality of die attach sites and configured to provide mapped information of said mounting substrate to an electronic file, said mapped information including locations on said mounting substrate of good die attach sites and defective die attach sites;
a die attach station coupled to said electronic file and configured to attach good dice to said good die attach sites and attach defective dice to said defective die attach sites in accord with said mapped information in said electronic file;
a molding station configured to provide encapsulant material to said mounting substrate and encapsulate each of said good dice and said defective dice, each attached to said good die attach sites and said defective die attach sites, respectively; and
a segregation station coupled to said electronic file and configured to segregate said plurality of die attach sites, each having a die attached thereon, into individual semiconductor die packages. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34)
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35. A method for assembling at least one semiconductor die to a substrate comprising:
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providing a mounting substrate having a plurality of die attach sites on a surface thereof;
evaluating said plurality of die attach sites on said mounting substrate to produce mapped information of good die attach sites and defective die attach sites;
providing said mapped information to an electronic file; and
attaching at least one semiconductor die to said mounting substrate according to said mapped information by one of attaching a known good die to a good die attach site of said good die attach sites and attaching a known defective die to a defective die attach site of said defective die attach sites. - View Dependent Claims (36, 37, 38)
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39. A method for fabricating semiconductor packages, the method comprising:
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providing a mounting substrate having a plurality of die attach sites on at least one surface thereof;
evaluating said plurality of die attach sites on said mounting substrate to provide mapped information of good die attach sites and defective die attach sites;
attaching at least one semiconductor die to said mounting substrate according to said mapped information by one of attaching a known good die to a good die attach site of said good die attach sites and attaching a known defective die to a defective die attach site of said defective die attach sites; and
encapsulating said mounting substrate using an encapsulation material. - View Dependent Claims (40, 41, 42, 43, 44, 45, 46)
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Specification