Light-mixing layer and method

• US 20030038596A1
• Filed: 02/28/2002
• Published: 02/27/2003
• Est. Priority Date: 08/21/2001
• Status: Abandoned Application

• Current Assignee: Wen-Chih Ho
• Original Assignee: Wen-Chih Ho
• Inventors: Ho, Wen-Chih
• Application Number:
  US10/084,876
• Publication Number:
  US 20030038596A1
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

The present invention discloses a light-mixing layer and method. At the manufacturing stage, the present invention arranges the particles of the composition in the light-mixing layer in an particle-interlaced order, and makes the light-mixing layer excite another wavelength after absorbing the light emitted from a light source. These two kinds of lights are mixed in the light-mixing layer to obtain a complete light diffusion, light transformation and light mixture to generate a light source with a high uniformity, high brightness and stable color temperature.

Claims

1. A light-mixing layer for absorbing a light source, comprising:

light-scattering particles for scattering the light emitted from the light source;

phosphor particles for converting a portion of the light originating from the light source into another wavelength light; and

diffuser particles for mixing the light emitted from the light-scattering particles and the phosphor particles;

wherein the light-scattering particles, phosphor particles and diffuser particles are arranged in a particle-interlaced order.

2. The light-mixing layer of claim 1, wherein an arrangement of the light-scattering particles, diffuser particles and phosphor particles is made by a process of printing, dispersion, SPIN, evaporation, inertial force, expressure, condensation, cladding or sputtering.

3. The light-mixing layer of claim 1, wherein the light-scattering particles are made of quartz, glass or polymeric transparent materials.

4. The light-mixing layer of claim 1, wherein the diffuser particles are selected from a group consisting of BaTiO₃, Ti₂O₃ and SiO_x.

5. The light-mixing layer of claim 1, wherein the phosphor particles are made of an inorganic phosphor matter.

6. The light-mixing layer of claim 1, which covers the light source by a process of inertial force, expressure or condensation.

7. The light-mixing layer of claim 1, which covers the light source by a coating or printing process.

8. The light-mixing layer of claim 1, which covers the light source by a sputtering, cladding or evaporation process.

9. The light-mixing layer of claim 1, which keeps a distance from the light source, and absorbs the light emitted from the light source by reflection.

10. The light-mixing layer of claim 1, wherein the light-scattering particles occupy 10% to 70% by weight, the phosphor particles occupy 10% to 65% by weight and the diffuser particles occupy 15% to 60% by weight.

11. An LED component, comprising a chip, a chip cup, electrodes and a transparent encapsulant, characterized in that the LED component includes a light-mixing layer for absorbing light emitted from the LED chip, the light-mixing layer including light-scattering particles for scattering the light emitted from the LED chip, phosphor particles for converting a portion of the light originating from the LED chip into another wavelength light and diffuser particles for mixing the light emitted from the light-scattering particles and the phosphor particles, wherein the light-scattering particles, phosphor particles and diffuser particles are arranged in a particle-interlaced order.

12. The LED component of claim 11, wherein the light-mixing layer covers the LED chip by a process of inertial force, expressure or condensation.

13. The LED component of claim 11, wherein the light-mixing layer covers the LED chip by a coating or printing process.

14. The LED component of claim 11, wherein the light-mixing layer covers the LED chip by a sputtering, cladding or evaporation process.

15. The LED component of claim 11, wherein the light-mixing layer keeps a distance from the LED chip, and the light-mixing layer absorbs the light emitted from the LED chip by reflection.

16. A light-mixing method, comprising the following steps:

providing a light-mixing layer including light-scattering particles, phosphor particles and diffuser particles, and the light-mixing layer used for absorbing the light emitted from a light source;

utilizing the light-scattering particles to scatter the light emitted from the light source;

utilizing the phosphor particles to convert a portion of the light originating from the light source into another wavelength light; and

utilizing the diffuser particles to mix the light emitted from the light-scattering particles and the phosphor particles.

17. The light-mixing method of claim 16, wherein an arrangement of the light-scattering particles, diffuser particles and diffuser particles is made by a process of printing, dispersion, SPIN, evaporation, inertial force, expressure, condensation, cladding or sputtering.

18. The light-mixing method of claim 16, wherein an arrangement of the light-scattering particles, phosphor particles and diffuser particles is dependent on a usage level of gravitation, inertia, pressure and solidification.

19. The light-mixing method of claim 16, wherein the light-scattering particles are made of quartz, glass or polymeric transparent materials.

20. The light-mixing method of claim 16, wherein the diffuser particles are selected from a group consisting of BaTiO₃, Ti₂O₃ and SiO_x.

21. The light-mixing method of claim 16, wherein the phosphor particles are made of an inorganic phosphor matter.

22. The light-mixing method of claim 16, wherein the light-scattering particles occupy 10% to 70% by weight, the phosphor particles occupy 10% to 65% by weight and the diffuser particles occupy 15% to 60% by weight.