Substrate processing system for performing exposure process in gas atmosphere
First Claim
1. A substrate processing system which sprays exposure process gas onto a substrate disposed within a chamber, the substrate processing system comprising:
- the chamber having at least one gas inlet and at least one gas outlets;
a gas introducing means which introduces the exposure process gas into the chamber via the gas inlet; and
a gas distributing means;
wherein the gas distributing means separates an inner space of the chamber into a first space into which the exposure process gas is introduced via the gas inlet and a second space in which the substrate is disposed;
the gas distributing means has a plurality of openings via which the first space and the second space communicate with each other; and
the gas distributing means introduces the exposure process gas introduced into the first space into the second space via the openings.
3 Assignments
0 Petitions
Accused Products
Abstract
A substrate processing system which sprays exposure process gas onto a substrate disposed within a chamber. The substrate processing system is used, for example, for performing an exposure process of an organic film formed on a substrate in a gas atmosphere obtained by vaporizing an organic solvent solution for dissolving and reflowing an organic film. The substrate processing system comprises: the chamber having at least one gas inlet and at least one gas outlets; a gas introducing means which introduces the exposure process gas into the chamber via the gas inlet; and a gas distributing means. The gas distributing means separates an inner space of the chamber into a first space into which the exposure process gas is introduced via the gas inlet and a second space in which the substrate is disposed. The gas distributing means has a plurality of openings via which the first space and the second space communicate with each other and introduces the exposure process gas introduced into the first space into the second space via the openings.
-
Citations
19 Claims
-
1. A substrate processing system which sprays exposure process gas onto a substrate disposed within a chamber, the substrate processing system comprising:
-
the chamber having at least one gas inlet and at least one gas outlets;
a gas introducing means which introduces the exposure process gas into the chamber via the gas inlet; and
a gas distributing means;
wherein the gas distributing means separates an inner space of the chamber into a first space into which the exposure process gas is introduced via the gas inlet and a second space in which the substrate is disposed;
the gas distributing means has a plurality of openings via which the first space and the second space communicate with each other; and
the gas distributing means introduces the exposure process gas introduced into the first space into the second space via the openings. - View Dependent Claims (3, 4, 5, 6, 7, 8, 11, 12, 13, 14, 15, 16, 17, 18, 19)
-
-
2. A substrate processing system which sprays exposure process gas onto each of a plurality of substrates disposed parallel within a chamber in a vertical direction, the substrate processing system comprising:
-
the chamber having at least one gas inlet and at least one gas outlets;
a gas introducing means which introduces the exposure process gas into the chamber via the gas inlet; and
gas distributing means each of which is provided for corresponding one of the plurality of substrates;
wherein the gas distributing means has a plurality of openings, and the exposure process gas introduced via the gas inlet into the chamber is sprayed onto the substrate via the openings.
-
-
9. A substrate processing system which sprays exposure process gas onto a substrate disposed within a chamber, the substrate processing system comprising:
-
the chamber having at least one gas inlet and at least one gas outlets;
a gas introducing means which introduces the exposure process gas into the chamber via the gas inlet; and
gas distributing means which sprays the exposure process gas introduced into the chamber onto the substrate;
wherein the gas distributing means is movable within the chamber along an upper wall of the chamber. - View Dependent Claims (10)
-
Specification