Method and apparatus for depositing films
First Claim
1. Apparatus for performing physical vapor deposition of a layer on a substrate, said apparatus comprising:
- a deposition chamber enclosing a plasma region for containing an ionizable gas;
an electromagnetic field generator surrounding said plasma region for inductively coupling an electromagnetic field into said plasma region to ionize the gas and generate and maintain a high density, low potential plasma;
a source of deposition material including a solid target constituting a source of material to be deposited onto the substrate;
means associated with said target for electrically biasing said target in order to cause ions in the plasma to strike said target and sputter material from said target; and
a substrate holder for holding the substrate at a location to permit material sputtered from said target to be deposited on the substrate.
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Abstract
A method and apparatus for performing physical vapor deposition of a layer or a substrate, composed of a deposition chamber enclosing a plasma region for containing an ionizable gas; an electromagnetic field generating system surrounding the plasma region for inductively coupling an electromagnetic field into the plasma region to ionize the gas and generate and maintain a high density, low potential plasma; a source of deposition material including a solid target constituting a source of material to be deposited onto the substrate; a unit associated with the target for electrically biasing the target in order to cause ions in the plasma to strike the target and sputter material from the target; and a substrate holder for holding the substrate at a location to permit material sputtered from the target to be deposited on the substrate.
81 Citations
34 Claims
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1. Apparatus for performing physical vapor deposition of a layer on a substrate, said apparatus comprising:
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a deposition chamber enclosing a plasma region for containing an ionizable gas;
an electromagnetic field generator surrounding said plasma region for inductively coupling an electromagnetic field into said plasma region to ionize the gas and generate and maintain a high density, low potential plasma;
a source of deposition material including a solid target constituting a source of material to be deposited onto the substrate;
means associated with said target for electrically biasing said target in order to cause ions in the plasma to strike said target and sputter material from said target; and
a substrate holder for holding the substrate at a location to permit material sputtered from said target to be deposited on the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A method for performing physical vapor deposition of a layer on a substrate, said method comprising:
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providing a deposition chamber enclosing a plasma region and containing a solid target constituting a source of material to be deposited in vapor form onto the substrate, and a substrate holder holding the substrate;
introducing an ionizable gas into the plasma region;
inductively coupling an electromagnetic RF field into the plasma region under conditions to ionize the gas and create a high density, low potential plasma;
biasing the target in order to cause ions in the plasma to strike the target and sputter material from the target; and
causing material sputtered from the target to be deposited as a layer on the substrate. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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Specification