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Method and apparatus for determining endpoint of semiconductor element fabricating process and method and apparatus for processing member to be processed

  • US 20030043383A1
  • Filed: 09/06/2001
  • Published: 03/06/2003
  • Est. Priority Date: 09/06/2001
  • Status: Active Grant
First Claim
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1. A method of measuring a film process quantity in a semiconductor device manufacturing process, comprising:

  • a) a step of setting standard patterns of differential values of interference light from a first material to be processed (4, 5, etc.) that correspond to a predetermined film process quantity of the first material, the standard patterns using the wavelength as a parameter;

    b) a step of measuring intensities of interference light of multiple wavelengths from a second material being processed (4, 5, etc.) of the same structure as the first material and determining actual patterns of differential values of the measured interference light intensities, the actual patterns using the wavelength as a parameter; and

    c) a step of determining a film process quantity (43) of the second material based on the standard patterns of the first material and the actual patterns.

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