INTEGRATED COOLING SYSTEM

• US 20030043544A1
• Filed: 09/05/2001
• Published: 03/06/2003
• Est. Priority Date: 09/05/2001
• Status: Active Grant

• Current Assignee: Stovokor Technology LLC (Intellectual Ventures LLC)
• Original Assignee: Microelectronics and Computer Technology Corporation
• Inventors: Nelson, Richard D., Somadder, Anjan
• Granted Patent: US 6,529,377 B1
• Time in Patent Office: Days
• US Class Current: 361/690
• CPC Class Codes: A61K 31/00 Medicinal preparations containing organic active ingredients
• CPC Class Codes: F28F 2250/08 Fluid driving means, e.g. pumps, fans
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making

Abstract

Systems and methods are described for integrated cooling system. A method includes: circulating a liquid inside a flexible multi-layer tape; and transporting heat between a heat source that is coupled to the flexible multi-layer tape and a heat sink that is coupled to the flexible multi-layer tape. A method includes installing a flexible multi-layer tape in an electrical system, wherein the flexible multi-layer tape includes a top layer; an intermediate layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, the intermediate layer defining a closed loop circuit for a circulating fluid. An apparatus includes a flexible multi-layer tape, including: a top layer; an intermediate layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, wherein the intermediate layer defines a closed loop circuit for a circulating fluid.

Claims

1. A method, comprising:

circulating a liquid inside a flexible multi-layer tape; and

transporting heat between a heat source that is coupled to the flexible multi-layer tape and a heat sink that is coupled to the flexible multi-layer tape.

2. The method of claim 1, wherein circulating the liquid inside the flexible multi-layer tape includes circulating the liquid inside the flexible multi-layer tape via a closed loop circuit.

3. The method of claim 1, wherein circulating the liquid inside the flexible multi-layer tape includes pumping the liquid inside the flexible multi-layer tape.

4. The method of claim 1, wherein circulating the liquid inside the flexible multi-layer tape includes circulating the liquid inside the flexible multi-layer tape in a preferred direction around the closed loop circuit via a plurality of valves.

5. The method of claim 1, wherein circulating the liquid includes circulating water.

6. The method of claim 1, wherein exchanging heat between the heat source and the heat sink includes flowing the liquid over a plurality of fins.

7. A method, comprising installing a flexible multi-layer tape in an electrical system, wherein the flexible multi-layer tape includes a top layer;

an intermediate layer coupled to the top layer; and

a bottom layer coupled to the intermediate layer, the intermediate layer defining a closed loop circuit for a circulating fluid.

8. The method of claim 7, further comprising providing a liquid within the closed loop circuit.

9. The method of claim 7, wherein

the flexible multi-layer tape includes

a heat extraction region,

a pumping region, and

a heat rejection region and

installing includes:

attaching the heat extraction region to an electronic component;

attaching the heat rejection region to a heat sink; and

coupling a pump to the pumping region.

10. The method of claim 9, further comprising bending the multi-layer flexible tape.

11. An apparatus, comprising a flexible multi-layer tape, including:

a top layer;

an intermediate layer coupled to the top layer; and

a bottom layer coupled to the intermediate layer,

wherein the intermediate layer defines a closed loop circuit for a circulating fluid.

12. The apparatus of claim 11, wherein the top layer includes a metal layer.

13. The apparatus of claim 11, wherein the intermediate layer includes a polymer layer.

14. The apparatus of claim 11, wherein the bottom layer includes a metal layer.

15. The apparatus of claim 11, wherein the intermediate layer defines a closed loop circuit.

16. The apparatus of claim 11, wherein the intermediate layer defines a plurality of internal cavities coupled together via the closed loop circuit.

17. The apparatus of claim 16, wherein the plurality of internal cavities include a plurality of heat exchange devices.

18. The apparatus of claim 17, wherein the plurality of heat exchange devices include at least one member selected from the group consisting of:

a longitudinal fin, a pin fin, a folded metal fin, a metal mesh, and a liquid impingement jet plate.

19. The apparatus of claim 15, wherein the closed loop circuit includes a heat extraction region, a pumping region and a heat rejection region.

20. The apparatus of claim 19, further comprising a pump coupled to the pumping region.

21. The apparatus of claim 20, wherein the pump includes at least one member selected from the group consisting of:

a bellows pump, a rotary pump, a diaphragm pump, a micromechanical gear pump, and an electrokinetic pump.

22. The apparatus of claim 20, wherein the pump is located in a cavity defined by the intermediate layer.

23. The apparatus of claim 11, further comprising a heat source coupled to the flexible multi-layer tape.

24. The apparatus of claim 23, wherein the heat source includes a plurality of electronic components.

25. The apparatus of claim 11, further comprising a heat sink coupled to the flexible multi-layer tape.

26. The apparatus of claim 25, wherein the heat sink includes a heat exchange unit.