Electronic device and method for manufacturing the same, and method for shielding printed circuit board

• US 20030043563A1
• Filed: 08/23/2002
• Published: 03/06/2003
• Est. Priority Date: 09/04/2001
• Status: Active Grant

• Current Assignee: Konica Corporation (Konica Minolta Inc.)
• Original Assignee: Konica Corporation (Konica Minolta Inc.)
• Inventors: Igarashi, Yutaka, Kishimoto, Tadao
• Granted Patent: US 6,706,964 B2
• Time in Patent Office: Days
• US Class Current: 361/800
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 9/0022 of components mounted on printed circuit boards [PCB] shields integrated within component packages H01L23/552; shields integrated within PCB H05K1/0218
• CPC Class Codes: H05K 9/0043 being flexible containers, e.g. pouch, pocket, bag

Abstract

An electronic device having a printed circuit board having a ground, an electrically insulating layer provided on a face of the printed circuit board, and an electromagnetic shielding layer adhered to the face of the printed circuit board through the electrically insulating layer. The ground of the printed circuit board and the electromagnetic shielding layer are conducted electrically.

Claims

1. An electronic device comprising:

a printed circuit board having a ground;

an electrically insulating layer provided on a face of the printed circuit board; and

an electromagnetic shielding layer adhered to the face of the printed circuit board through the electrically insulating layer;

wherein the ground of the printed circuit board and the electromagnetic shielding layer are conducted electrically.

2. The device of claim 1, wherein the electrically insulating layer is a resin layer, and the electromagnetic shielding layer is formed by applying an electroconductive paste on the resin layer.

3. The device of claim 2, wherein a coat is provided on the electromagnetic shielding layer formed with the electroconductive paste.

4. The device of claim 1, wherein the electromagnetic shielding layer is plate-like.

5. The device of claim 1, wherein the electromagnetic shielding layer is a metal member.

6. The device of claim 1, wherein the electromagnetic shielding layer covers an end face of the printed circuit board.

7. The device of claim 1, wherein the printed circuit board is a multi-layer printed circuit board in which a power supply layer is disposed in an external layer of the electromagnetic shielding layer side.

8. The device of claim 1, wherein the electromagnetic shielding layer is a bag-like member, and the electrically insulating layer is provided on an inner face of the bag-like member.

9. The device of claim 1, wherein the electrically insulating layer is sheet-like.

10. The device of claim 1, wherein a dielectric constant of the electrically insulating layer is not less than 5.

11. A method for manufacturing an electronic device, comprising:

providing an electrically insulating layer on a face of a printed circuit board having a ground;

providing an electromagnetic shielding layer so as to adhere to the face of the printed circuit board through the electrically insulating layer; and

conducting the ground of the printed circuit board and the electromagnetic shielding layer electrically.

12. The method of claim 11, wherein the providing the electrically insulating layer comprises applying an electrically insulating resin layer, and the providing the electromagnetic shielding layer comprises applying an electroconductive paste on the resin layer.

13. The method of claim 12, further comprising providing a coat on the electromagnetic shielding layer provided with the electroconductive paste.

14. A method for manufacturing an electronic device, comprising:

inserting a printed circuit board into a bag-like electromagnetic shielding member, an electrically insulating layer being provided on an inner face of the electromagnetic shielding member; and

adhering the electromagnetic shielding member to a face of the printed circuit board through the electrically insulating layer by extracting air in the bag-like electromagnetic shielding member in which the printed circuit board is inserted.

15. A method for shielding a printed circuit board, comprising:

providing an electrically insulating layer on a face of the printed circuit board having a ground;

providing an electromagnetic shielding layer so as to adhere to the face of the printed circuit board through the electrically insulating layer; and

conducting the ground of the printed circuit board and the electromagnetic shielding layer electrically.

16. A method for shielding a printed circuit board, comprising:

inserting a printed circuit board into a bag-like electromagnetic shielding member, an electrically insulating layer being provided on an inner face of the electromagnetic shielding member; and

adhering the electromagnetic shielding member to a face of the printed circuit board through the electrically insulating layer by extracting air in the bag-like electromagnetic shielding member in which the printed circuit board is inserted.