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Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding

  • US 20030045015A1
  • Filed: 06/27/2002
  • Published: 03/06/2003
  • Est. Priority Date: 07/23/2001
  • Status: Active Grant
First Claim
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1. A method of mounting a light emitting device having a gallium nitride based light emitting region on a silicon carbide substrate in a flip-chip configuration, the method comprising:

  • mounting an electrode of the gallium nitride based light emitting region to a submount utilizing a B-stage curable die epoxy.

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