Wireless communication apparatus

• US 20030045324A1
• Filed: 08/26/2002
• Published: 03/06/2003
• Est. Priority Date: 08/30/2001
• Status: Abandoned Application

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Ishihara, Takashi, Sato, Jin, Nagumo, Shoji, Onaka, Kengo
• Application Number:
  US10/227,462
• Publication Number:
  US 20030045324A1
• Time in Patent Office: Days
• US Class Current: 455/550.1
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 19/005 Patch antenna using one or more coplanar parasitic elements
• CPC Class Codes: H01Q 5/371 Branching current paths
• CPC Class Codes: H01Q 5/385 Two or more parasitic elements
• CPC Class Codes: H01Q 5/392 the parasitic elements having dual-band or multi-band characteristics
• CPC Class Codes: H04B 1/3833 Hand-held transceivers

Abstract

A wireless communication apparatus includes a casing made of a dielectric material. An antenna including a feed element and first and second parasitic elements is provided in the casing. The feed element includes first and second feed radiation plates. A parasitic radiation plate of the first parasitic element is located near the first radiation plate, and a parasitic radiation plate of the second parasitic element is located near the second feed radiation plate. The amount of coupling between the feed element and the first and second parasitic elements is adjusted based on the relative permittivity of the casing. The feed element and the first parasitic element perform multi-resonance in the same frequency band as the resonance frequency of the first feed radiation plate. The feed element and the second parasitic element perform multi-resonance in the same frequency band as the resonance frequency of the second feed radiation plate.

Claims

1. A wireless communication apparatus comprising:

a circuit board having a high-frequency circuit disposed therein;

a casing accommodating the circuit board; and

an antenna disposed inside the casing or on a surface of the casing, the antenna including;

a feed element having at least one feed radiation plate and a feed terminal plate connecting the feed radiation plate to the high-frequency circuit; and

at least one parasitic element having a parasitic radiation plate located adjacent to and along the feed radiation plate of the feed element and a ground terminal plate connecting the parasitic radiation plate to a ground surface of the circuit board.

2. The wireless communication apparatus according to claim 1, wherein the end of the feed radiation plate opposite to the side of the feed terminal plate is an open end, the end of the parasitic radiation plate opposite to the side of the ground terminal plate is an open end, a capacitance loading plate is disposed at at least one of the open ends, and a ground plate which is fixed to the casing and which faces the capacitance loading plate is provided.

3. The wireless communication apparatus according to claim 1, wherein the antenna is incorporated into the casing.

4. The wireless communication apparatus according to claim 1, wherein the antenna is disposed on an inner wall of the casing.

5. The wireless communication apparatus according to claim 1, wherein a portion or all of at least one of the feed element and the parasitic element is embedded in the casing, except a feed contact terminal disposed in the feed element and a ground contact terminal disposed in the parasitic element.

6. The wireless communication apparatus according to claim 1, wherein the relative permittivity of the casing is used to adjust the coupling relationship between the feed element and the parasitic element.

7. The wireless communication apparatus according to claim 1, wherein at least an antenna setting portion of the casing is molded of a composite dielectric material.

8. The wireless communication apparatus according to claim 1, wherein a portion of the casing in which the feed element and the parasitic element are disposed or a portion along the adjacent edges of the feed radiation plate of the feed element and the parasitic radiation plate of the parasitic element is made of a dielectric material having a relative permittivity which is higher than that of the casing.

9. The wireless communication apparatus according to claim 4, wherein a dielectric member having a relative permittivity which is higher than that of the casing is disposed between the inner wall of the casing, the feed radiation plate of the feed element, and the parasitic radiation plate of the parasitic element.

10. The wireless communication apparatus according to claim 1, wherein the feed contact terminal and the ground contact terminal are resilient, the resilient feed contact terminal is provided in the feed radiation plate, and the resilient ground contact terminal is provided in the parasitic radiation plate.

11. The wireless communication apparatus according to claim 1, wherein the casing includes a first casing and a second casing, the circuit board provided with a feed contact land and a ground contact land is placed in the first casing, the antenna including the feed contact terminal and the ground contact terminal is placed in the second casing, whereby the feed contact terminal contacts the feed contact land so as to be energized and the ground contact terminal contacts the ground contact land so as to be energized when the first and second casings are combined.

12. The wireless communication apparatus according to claim 1, wherein wireless communication apparatus is a mobile phone.

13. The wireless communication apparatus according to claim 1, wherein the feed element includes first and second feed radiation plates formed by dividing a common radiation plate by a slit and a feed terminal plate which is substantially perpendicular to the common radiation plate.

14. The wireless communication apparatus according to claim 1, wherein the at least one parasitic element includes a parasitic radiation plate, a strip-like ground terminal plate provided at one end in the longitudinal direction of the parasitic radiation plate, the ground terminal plate being substantially perpendicular to the parasitic radiation plate, and a capacitance loading plate which is substantially perpendicular to the parasitic radiation plate and which extends in the same direction as the ground terminal plate.

15. The wireless communication apparatus according to claim 1, wherein the at least one feed radiation plates and the parasitic radiation plate are arranged so as to be exposed at the surface of a bottom wall of the casing.

16. The wireless communication apparatus according to claim 1, wherein the feed terminal plate and the ground terminal plate are embedded in a shorter side wall of the casing.

17. The wireless communication apparatus according to claim 1, wherein the feed element and the parasitic element are excited by electric-field-coupling via a capacitance generated between the parasitic radiation plate and the at least one feed radiation plate and by magnetic-field-coupling between the ground terminal plate and the feed terminal plate.

18. The wireless communication apparatus according to claim 1, wherein the feed element and the parasitic element are excited by electric-field-coupling via the capacitance generated between the parasitic radiation plate and the at least one feed radiation plate and by magnetic-field-coupling between the ground terminal plate and the feed terminal plate.

19. The wireless communication apparatus according to claim 2, wherein edges of the capacitance loading plate and the ground plate provided in the parasitic radiation plate face each other.

20. The wireless communication apparatus according to claim 2, wherein the capacitance loading plate and the ground plate are arranged so that side surfaces thereof face each other.