Printed-circuit board with fuse

• US 20030048620A1
• Filed: 09/12/2002
• Published: 03/13/2003
• Est. Priority Date: 03/14/2000
• Status: Abandoned Application

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Nakamura, Satoshi, Suzuki, Saizou, Nishimura, Kohshi
• Application Number:
  US10/221,616
• Publication Number:
  US 20030048620A1
• Time in Patent Office: Days
• US Class Current: 361/760
• CPC Class Codes: H01H 2069/027 using ultrasonic techniques
• CPC Class Codes: H01H 2085/0275 Structural association with a printed circuit board
• CPC Class Codes: H01H 85/0047 Heating means
• CPC Class Codes: H01H 85/0411 Miniature fuses
• CPC Class Codes: H01H 85/046 Fuses formed as printed circuits
• CPC Class Codes: H01H 85/463 with printed circuit fuse
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 1/0293 Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
• CPC Class Codes: H05K 2201/0305 Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
• CPC Class Codes: H05K 2201/0394 Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 2201/062 Means for thermal insulation, e.g. for protection of parts
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/09727 Varying width along a single conductor; Conductors or pads having different widths
• CPC Class Codes: H05K 2201/0989 Coating free areas, e.g. areas other than pads or lands free of solder resist
• CPC Class Codes: H05K 2201/10037 Printed or non-printed battery
• CPC Class Codes: H05K 2201/10181 Fuse
• CPC Class Codes: H05K 2203/049 Wire bonding
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence
• CPC Class Codes: H05K 3/4697 having cavities, e.g. for mounting components H05K3/4691 takes precedence

Abstract

A printed wiring board includes a substrate (20) on which a wiring pattern (12) has been formed, and a fuse (6) provided on the substrate (20). One end of the fuse (6) is directly connected to a first pad (12a) of the wiring pattern (12), and the other end of the fuse (6) is directly connected to a second pad (12b) of the wiring pattern (12). The fuse (6) is covered by a protective material (7).

Claims

1. A printed wiring board, comprising:

an insulating substrate on which a wiring pattern has been formed; and

a fuse including circuit breaking means,

the circuit breaking means being directly connected to the wiring pattern.

2. The printed wiring board according to claim 1, wherein the wiring pattern includes two conductor pads that are apart from each other, and the circuit breaking means bridges the two conductor pads.

3. The printed wiring board according to claim 1, wherein the circuit breaking means is covered with a protective material.

4. The printed wiring board according to claim 1, further comprising at least one electronic part mounted on the substrate, and the circuit breaking means being disposed lower than the electronic part.

5. The printed wiring board according to claim 1, wherein the circuit breaking means is a solder wire.

6. The printed wiring board according to claim 1, further comprising heat insulating means disposed in the vicinity of the circuit breaking means.

7. The printed wiring board according to claim 1, wherein the circuit breaking means is formed integrally with the wiring pattern.

8. The printed wiring board according to claim 7, wherein the circuit breaking means is a relatively narrow portion of the wiring pattern.

9. The printed wiring board according to claim 8, wherein the wiring pattern is composed of copper.

10. The printed wiring board according to claim 6, further comprising a resist layer that covers the wiring pattern, and the heat insulating means including an opening formed in the resist layer.

11. The printed wiring board according to claim 6, wherein the heat insulating means is a through hole provided to the substrate.

12. The printed wiring board according to claim 11, wherein the circuit breaking means bridges the through hole.

13. The printed wiring board according to claim 11, wherein the circuit breaking means is provided inside the through hole.

14. The printed wiring board according to claim 6, the heat insulating means being a recess provided to the substrate.

15. The printed wiring board according to claim 14, wherein the circuit breaking means bridges the recess.

16. The printed wiring board according to claim 6, further comprising an additional insulating substrate, and the heat insulating means including a through hole formed in the additional insulating substrate.

17. The printed wiring board according to claim 6, further comprising an additional insulating substrate, and the heat insulating means including a recess formed in the additional insulating substrate.