Multi-folded printed wiring construction for an implantable medical device

• US 20030048621A1
• Filed: 09/10/2001
• Published: 03/13/2003
• Est. Priority Date: 09/10/2001
• Status: Active Grant

• Current Assignee: Cardiac Pacemakers Incorporated (Boston Scientific Corporation)
• Original Assignee: Cardiac Pacemakers Incorporated (Boston Scientific Corporation)
• Inventors: Kane, Michael J., Sweeney, Moira B., Blood, James E.
• Granted Patent: US 6,665,191 B2
• Time in Patent Office: Days
• US Class Current: 361/785
• CPC Class Codes: A61N 1/00 Electrotherapy; Circuits therefor A61N2/00 takes precedence; irradiation apparatus A61N5/00
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence

Abstract

A printed circuit assembly for use in an implantable medical device comprises a plurality of panels having active and passive circuit components on one major surface thereof, the plurality of panels being interconnected with flexible flat cable segments allowing the assembly to be folded so as to place the individual panels carrying the circuit components in a stacked relationship. By providing conductive layers on predetermined surfaces of the panels, shielding is provided to inhibit noise generating circuitry from contaminating wanted signals passing between the components and the plural panels.

Claims

1. A circuit assembly comprising:

a plurality of circuit panels having active and passive components on only one major surface thereof and at least one flexible, flat cable interconnect, the circuit panels being electrically coupled by the flexible, flat cable interconnect with the plurality of circuit panels being placed in a stacked, juxtaposed relationship by folding the flexible flat cable interconnect so as to, at least in part, overlap the circuit panels relative to one another with the major surfaces carrying the components facing away from one another.

2. The circuit assembly as in claim 1 wherein the flexible flat cable interconnects are folded so as to place the plurality of circuit panels in a substantially parallel, stacked orientation relative to one another.

3. The circuit assembly as in claim 1 wherein the circuit panels further comprise a conductive ground plane shield configured to prevent electrical interference between the circuit panels when stacked.

4. A circuit assembly comprising:

at least four printed circuit panels having active and passive circuit components mounted thereon, the four panels being interconnected by flexible flat cabling to form a two by two matrix when the flexible flat cabling is unfolded and the four panels being arranged in a one by four stack when the flexible flat cabling is folded.

5. The circuit assembly as in claim 4 wherein the circuit panels further comprise a conductive ground plane shield configured to prevent electrical interference between the circuit panels when stacked.

6. The circuit assembly of claim 5 and further including terminals coupled to the flexible, flat cabling to which electrical power is adapted to be applied.

7. The circuit assembly of claim 6 and further including a test point panel interconnected to at least one of said four printed circuit panels with flexible, flat cabling.

8. The circuit assembly as in claim 7 wherein the circuit panels further comprise a conductive ground plane shield configured to prevent electrical interference between the circuit panels when stacked.

9. The circuit assembly as in claim 6 wherein the at least four printed circuit panels are generally rectangular and of substantially equal area.

10. The circuit assembly of claim 6 and further including a molded plastic retainer adapted to receive the one by four stacks therein for retaining the stack in a folded state.

11. A method for producing a compact electronic circuit assembly for use in an implantable medical device, comprising the steps of:

(a) forming a printed circuit substrate comprising a plurality of panels, each panel having first and second major surfaces with a pattern of metallization thereon, the plurality of panels being interconnected by flexible printed circuitry links;

(b) populating the plurality of panels on the first major surface thereof with active and passive circuit components;

(c) folding the printed circuit substrate through the flexible printed circuitry links along a first fold line such that the second major surfaces of predetermined ones of the plurality of panels are juxtaposed in face-to-face relation; and

(d) following step (c), folding the printed circuit substrate through the flexible circuitry links along a second fold line that extends transverse to the first fold line to thereby place the plurality of panels in a stacked relationship.

12. The method of claim 11 and further including the step of:

(a) providing a retainer member; and

(b) placing the printed circuit substrate with the plurality of panels in stacked relationship into the retainer member.

13. The method of claim 11 wherein each of the panels includes a conductive shielding layer and the steps of folding the substrate along the first and second fold lines positions the conductive shielding layer between circuit components on separate ones of the plurality of panels.