Method of and apparatus for inspection of articles by comparison with a master

• US 20030048939A1
• Filed: 10/31/2002
• Published: 03/13/2003
• Est. Priority Date: 05/18/1999
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Lehman, Yonatan
• Application Number:
  US10/287,168
• Publication Number:
  US 20030048939A1
• Time in Patent Office: Days
• US Class Current: 382/144
• CPC Class Codes: G01N 21/9501 Semiconductor wafers manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G01N 21/95607 using a comparative method
• CPC Class Codes: G03F 1/84 Inspecting

Abstract

A simple, powerful technique for facilitating defect inspection in manufactured articles, especially articles used in or resulting from semiconductor fabrication. In the case of an article having a chrome and glass pattern thereon, such as a reticle or other article used in photolithography, a master version is identified, in as pristine a fashion as possible. That master version is imaged and stored, and that image used subsequently for comparison to other correspondingly patterned articles as part of an inspection process. The data provided by reading the recorded image of the master article substitutes for data derived from prior Die to Die or Die to Database comparisons. The invention also is directed to an apparatus which enables the nonvolatile storage of one or more of such master versions for use in article inspection.

Claims

1. A method of inspecting articles related to semiconductor manufacture comprising:

a) creating a defect free master image by losslessly imaging a defect free article and storing such defect-free master image;

b) imaging the article under inspection;

c) comparing the image of article under inspection with the defect-free master image;

d) outputting the results of the image comparison, specifically identifying locations of image deviations.

2. A method as in claim 1 wherein the storage of the defect free master comprises recording on some digital storage medium.

3. A method as in claim 1 where the article is one of a mask, a photomask or a reticle.

4. A method as in claim 1, where the imaging of the article under inspection further includes:

binarizing the scanned image and generating a first digital data stream binarizing the defect free master image and generating a second digital data stream comparing the first and second digital data streams.

5. A method as claimed in 1, comprising the following additional step:

b1) after said step b), making defect free master image version available to users in remote locations, such that said users can perform said steps c and d using said image of said master version.

6. A method as claimed in claim 5, wherein said step b1) comprises the step of placing said defect free master image on at least one of:

a local area network;

a wide area network and an intranet.

7. A method as claimed in claim 6, wherein said step b1) comprises the step of placing said image of said master version on a plurality of removable storage media and distributing said removable storage media.

8. A method of obtaining a recorded image of a defect free master article for comparison with correspondingly-patterned articles to identify possible defects and thereby avoid replication of said defects during manufacture of semiconductor devices, said method comprising:

a) identifying said defect free master article to be used in the course of said comparison by inspection of product produced by said defect free master article;

b) scanning said defect free master article to obtain an image thereof; and

c) recording said image of said defect free master article on a storage medium;

such that said image recorded on said storage medium is of a form in which it can be compared with a correspondingly patterned article to identify possible defects in said correspondingly-patterned article, so as to avoid replication of said defects during said manufacture of said semiconductor devices.

9. A method as claimed in claim 8, wherein said semiconductor devices are manufactured using a photolithographic process.

10. A method as claimed in claim 8, wherein said master article has at least one chrome and glass pattern formed thereon.

11. A method as claimed in claim 8, wherein said step c) comprises recording said image of said master article on at least one of:

a laser disk, a digital video disk (DVD), a jukebox of DVDs, a magnetic hard disk drive, a magneto-optical storage medium, a “

redundant array of inexpensive disks”

(RAID)-based system, or a “

just a bunch of disks”

(JBOD)-based system.

12. A method as claimed in claim 8, wherein both said defect free master article and said correspondingly-patterned article are one of a reticle, a mask, or a photomask.

13. A method as claimed in claim 8, wherein said step c) compromises recording data relating to setup for inspecting said correspondingly-patterned article, including alignment data.

14. A method of inspecting an article having a pattern forming a plurality of die designs thereupon, said pattern being used in the manufacture of semiconductor devices, said method comprising:

a) inspecting at least one article to identify a die which is demonstrably defect free;

b) obtaining a master image of the die;

c) recording the master image onto a storage medium;

d) obtaining an inspected image of a die of the article to be inspected; and

e) comparing the inspected image to the master image and identifying as defective each location of the inspected image that is inconsistent with a corresponding location on the master image, so as to avoid replication of defects during said manufacture of said semiconductor devices

15. A method as claimed in claim 14, wherein said pattern is a chrome and glass pattern for the manufacture of said semiconductor devices.

16. A method as claimed in claim 15, wherein said semiconductor devices are manufactured using a photolithographic process, said article being used in said photolithographic process

17. A method as claimed in claim 15, wherein said article is one of a reticle, a mask or a photomask

18. An apparatus for inspecting specimen patterned articles where such patterns have been transferred to the articles during the manufacture of semiconductor devices and where such inspection is compared against a defect free image created by a high resolution scan of such a patterned article and where such scanned article and resulting scan are determined to be error free, said apparatus comprising:

(A) a high resolution scanning device which creates images of the patterned articles;

(B) non-volatile recording media operate to record images of patterned articles, both specimen articles and defect free articles.

19. An apparatus as in claim 18 further comprising:

(C) a processing apparatus

C.1 operable to binarize a specimen article image and to generate a first digital stream;

C.2 operable to binarize a defect free article image and to generate a second digital data stream;

C.3 and which compares the first and second digital data streams;

D. an output device operable to output indicating degree of matching between first and second digital datastreams.

20. An apparatus as claimed in claim 19, wherein said scanning device comprises an interferometer.

21. An apparatus as claimed in claim 20, wherein said interferometer is a Twyman-Green interferometer.

22. An apparatus as claimed in claim 19, wherein said imaging device comprises a transmitted light detector, said transmitted light detector providing outputs to said processing device to produce said first stream of binarized data.

23. An apparatus as claimed in claim 22, wherein said imaging device further comprises a reflected light detector, said reflected light detector providing output to said processing device along with said transmitted light detector to produce said first stream of binarized data.

24. An apparatus as claimed in claim 22, wherein said transmitted light detector is a charge-coupled device (CCD).

25. An apparatus as claim in claim 24, wherein said reflected light detector is a CCD.