Micromechanical component and corresponding production method
First Claim
Patent Images
1. A micromechanical component comprising:
- a substrate (1);
a micromechanical functional plane (100) provided on the substrate;
a covering plane (200) provided on the micromechanical function plane (100); and
a printed circuit trace plane (300) provided on the covering plane (200);
wherein the covering plane (200) features a monocrystalline region (14) which is epitaxially grown on an underlying monocrystalline region (7;
24); and
the covering plane (200) features a preferably polycrystalline region (15) which is epitaxially grown on an underlying polycrystalline starting layer (13) at the same time.
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Abstract
The present invention provides a micromechanical component including a substrate (1); a micromechanical functional plane (100) provided on the substrate; a covering plane (200) provided on the micromechanical functional plane (100); and a printed circuit trace plane (300) provided on the covering plane (200). The covering plane (200) features a monocrystalline region (14) which is epitaxially grown on an underlying monocrystalline region (7; 24); and the covering plane (200) features a polycrystalline region (15) which is epitaxially grown on an underlying polycrystalline starting layer (13) at the same time.
35 Citations
9 Claims
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1. A micromechanical component comprising:
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a substrate (1);
a micromechanical functional plane (100) provided on the substrate;
a covering plane (200) provided on the micromechanical function plane (100); and
a printed circuit trace plane (300) provided on the covering plane (200);
wherein the covering plane (200) features a monocrystalline region (14) which is epitaxially grown on an underlying monocrystalline region (7;
24); and
the covering plane (200) features a preferably polycrystalline region (15) which is epitaxially grown on an underlying polycrystalline starting layer (13) at the same time. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for manufacturing a micromechanical component comprising the steps of:
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providing a substrate (1);
providing a micromechanical functional plane (100) on the substrate (1);
providing a covering plane (200) on the micromechanical functional plane (100);
providing a polysilicon starting layer (13) region-wise on the micromechanical functional plane (100), and leaving open region-wise a monocrystalline region (7, 24) of the micromechanical functional plane (100);
epitaxially depositing a monocrystalline region (14) on the monocrystalline region (7, 24) left open and epitaxially depositing a polycrystalline region (15) on the polycrystalline starting layer (13) at the same time; and
providing a printed circuit trace plane (300) on the covering plane (200).
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Specification