HIGH TEMPERATURE CERAMIC HEATER ASSEMBLY WITH RF CAPABILITY
First Claim
1. An assembly comprising:
- a ceramic upper layer;
a perforated metal layer having a plurality of perforations, said perforated metal layer disposed below said ceramic upper layer;
a plurality of electrodes coupled to an electrode base, said electrodes electrically coupling said perforated metal layer to said electrode base; and
a ceramic bonding disk disposed between said perforated metal layer and said electrode base, said ceramic bonding disk having a plurality of holes through which said electrodes extend through said ceramic bonding disk to said perforated metal layer, wherein said ceramic upper layer is bonded to said ceramic bonding disk through at least one of said plurality of perforations in said perforated metal layer.
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Accused Products
Abstract
The present invention provides techniques for coupling radio-frequency (RF) power to a metal plate in a ceramic pedestal. Perforations in the metal plate allow ceramic-to-ceramic bonding through the metal plate. The power from an RF power feed is distributed to the perforated metal plate via several electrodes that are spaced away from the centerline of the RF power feed, thus splitting power distribution. A ceramic bonding disk between the metal plate and the RF power feed provides mechanical support for the metal plate and a ceramic body to bond to through the perforations, thus reducing cracking of the metal plate and the surrounding ceramic material.
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Citations
19 Claims
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1. An assembly comprising:
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a ceramic upper layer;
a perforated metal layer having a plurality of perforations, said perforated metal layer disposed below said ceramic upper layer;
a plurality of electrodes coupled to an electrode base, said electrodes electrically coupling said perforated metal layer to said electrode base; and
a ceramic bonding disk disposed between said perforated metal layer and said electrode base, said ceramic bonding disk having a plurality of holes through which said electrodes extend through said ceramic bonding disk to said perforated metal layer, wherein said ceramic upper layer is bonded to said ceramic bonding disk through at least one of said plurality of perforations in said perforated metal layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification