Security tag and process for making same

• US 20030051806A1
• Filed: 09/05/2002
• Published: 03/20/2003
• Est. Priority Date: 09/17/2001
• Status: Active Grant

• Current Assignee: CHECKPOINT SYSTEMS, INC. (CCL Industries Incorporated)
• Original Assignee: CHECKPOINT SYSTEMS, INC. (CCL Industries Incorporated)
• Inventors: Lopez Perez, David, Matsumoto, Takeshi, Appalucci, Lawrence, Cote, Andre, Soler Bonnin, Luis Francisco, Imaichi, Hideaki, Piccoli, Anthony Frank, Martinez, Rolando Roques, Mazoki, Gary Thomas
• Granted Patent: US 6,988,666 B2
• Time in Patent Office: Days
• US Class Current: 156/270
• CPC Class Codes: B32B 2311/24 Aluminium
• CPC Class Codes: B32B 2317/12 Paper, e.g. cardboard
• CPC Class Codes: B32B 38/0004 Cutting, tearing or severing, e.g. bursting; Cutter details cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: G08B 13/244 Tag manufacturing, e.g. continuous manufacturing processes
• CPC Class Codes: Y10T 156/108 Flash, trim or excess removal
• CPC Class Codes: Y10T 156/1085 One web only

Abstract

A method of making a resonant frequency circuit is disclosed. The method includes the steps of: (1) forming a first adhesive layer in a first predetermined pattern on a surface of a first substrate; (2) laminating a first conductive foil to the surface of the first substrate to form a first conductive layer; (3) forming a first portion of the first conductive layer in a shape generally corresponding to the first predetermined pattern; and (4) removing a second portion of the first conductive layer not corresponding to the first portion to establish a first conductive trace on the first substrate. A third conductive trace is formed on a third substrate. The third conductive trace is secured to the first conductive trace with a dielectric layer therebetween to form the resonant frequency circuit.

Claims

1. A method of making a resonant tag comprising the steps of:

forming a first adhesive layer in a first predetermined pattern on a surface of a first substrate;

laminating a first conductive foil to the surface of the first substrate to form a first conductive layer;

forming a first portion of the first conductive layer in a shape generally corresponding to the first predetermined pattern; and

removing a second portion of the first conductive layer not corresponding to the first portion to thereby establish a first conductive trace on the surface of the first substrate.

2. The method as recited in claim 1, wherein the first conductive trace comprises a first inductor and a first capacitor plate.

3. The method as recited in claim 2 wherein the second portion is removed by:

forming a second adhesive layer on a second substrate in a pattern generally corresponding to the second portion;

laminating the second substrate to the first substrate such that the second adhesive pattern engages the second portion of the first conductive layer; and

separating the second substrate, including the second portion, from the first substrate to form a second conductive trace on the second substrate, wherein the first portion is formed by diecutting prior to laminating the second substrate to the first substrate.

4. The method as recited in claim 3, further comprising the step of simultaneously storing the first substrate with the first conductive layer on a first rewind roll and the second substrate with the second conductive trace on a second rewind roll.

5. The method as recited in claim 3, wherein the second conductive trace comprises at least one second inductor and at least one second capacitor plate.

6. The method as recited in claim 5, wherein an inductance of the first inductor is substantially equal to an inductance of the second inductor, and an area of the first capacitor plate is substantially equal to the an area of the second capacitor plate.

7. The method as recited in claim 5, further comprising the steps of:

forming a third conductive trace on a third substrate, the third conductive trace including at least a third capacitor plate; and

securing the third conductive trace to the second conductive trace with a dielectric layer therebetween and with the third capacitor plate overlying and generally aligned with the second capacitor plate.

8. The method according to claim 7, wherein the third conductive trace has a repeat length that is smaller than a repeat length of the second conductive trace.

9. The method as recited in claim 7, wherein the third conductive trace is secured to the second conductive trace by heating the second substrate and the third substrate over an area larger than the third conductive trace.

10. The method as recited in claim 7, wherein the third conductive trace is formed by the steps of:

forming the dielectric layer on a first surface of the second conductive foil;

forming a third adhesive layer on a second surface of a second conductive foil;

laminating the second conductive foil to the third substrate with the adhesive therebetween to form a second conductive layer;

cutting the second conductive layer to form a first portion in the shape of the third conductive trace; and

removing from the third substrate, a second portion of the second conductive layer not corresponding to the first portion.

11. The method as recited in claim 10 wherein the third adhesive layer is formed from a removable, pressure sensitive adhesive.

12. The method as recited in claim 11, wherein the third adhesive layer is flood coated.

13. The method as recited in claim 10, wherein the dielectric is a heat seal dielectric applied by printing.

14. The method as recited in claim 7 further comprising the steps of:

establishing an electrical connection between the third conductive trace and one or the other of the first and the second conductive traces; and

establishing a weakened area of the dielectric layer in the area between the third capacitor plate and one or the other of the first and second capacitor plates.

15. The method as recited in claim 2, further comprising the steps of:

forming a third conductive trace on a third substrate, the third conductive trace including a third capacitor plate; and

securing the third conductive trace to the first conductive trace with a dielectric layer therebetween and with the third capacitor plate overlying and generally aligned with the first capacitor plate.

16. The method according to claim 15, wherein the third conductive trace has a repeat length that is smaller than a repeat length of the second conductive trace.

17. The method as recited in claim 15, wherein the third conductive trace is secured to the first conductive trace by heating at least the third substrate over an area larger than the third conductive trace.

18. The method according to claim 15, wherein the third conductive trace is formed by the steps of:

forming the dielectric layer on a first surface of the second conductive foil;

forming a third adhesive layer on a second surface of a second conductive foil;

laminating the second conductive foil to the third substrate with the adhesive therebetween to form a second conductive layer;

cutting the second conductive layer to form a first portion in the shape of the third conductive trace; and

removing a second portion of the second conductive layer not corresponding to the first portion from the third substrate.

19. The method as recited in claim 18 wherein the third adhesive layer is formed from a pressure sensitive adhesive.

20. The method as recited in claim 19, wherein the third adhesive layer is flood coated.

21. The method as recited in claim 18, wherein the dielectric is a heat seal dielectric applied by printing.

22. The method as recited in claim 15 further comprising the steps of:

establishing an electrical connection between the third conductive trace and one or the other of the first and the second conductive traces; and

establishing a weakened area of the dielectric layer in the area between the third capacitor plate and one or the other of the first and second capacitor plates.

23. The method as recited in claim 1, wherein the first conductive layer is formed into the shape generally corresponding to the pattern of the first adhesive layer by diecutting.

24. The method as recited in claim 1, wherein the first adhesive layer is applied by printing.

25. The method as recited in claim 24, wherein the first adhesive layer is applied by flexographic printing.

26. The method as recited in claim 1, wherein the first adhesive layer is comprised of an aggressive pressure sensitive adhesive.

27. The method as recited in claim 1, wherein the adhesive is cured by ultraviolet radiation or by an electron beam.

28. The method as recited in claim 1, further including the step of applying a dielectric to both sides of the first conductive layer prior to laminating the first conductive foil to the first substrate.

29. The method as recited in claim 28, wherein the dielectric is a heat-seal dielectric applied by printing.

30. A method of making a resonant frequency circuit comprising the steps of:

securing a first conductive foil to a first surface of a first substrate to form a first conductive layer;

etching the first conductive layer to form a first conductive trace, the first conductive trace including at least one inductor and at least one first capacitor plate;

securing a second conductive foil to a second substrate to form a second conductive layer;

forming a second conductive trace on the second substrate by cutting the second conductive layer and removing a waste portion of the second conductive layer, wherein the second conductive trace includes at least a second capacitor plate; and

laminating the second conductive trace to the first conductive trace with a dielectric layer therebetween, the at least one second capacitor plate overlying and generally aligned with the at least one first capacitor plate.

31. The method according to claim 30, wherein the third conductive trace has a repeat length that is smaller than a repeat length of the second conductive trace.

32. The method according to claim 30, wherein the first substrate is a dielectric and the dielectric layer is formed from the first substrate;

33. The method according to claim 30, further including the step of coating the first conductive trace with a dielectric to form the dielectric layer.

34. The method according to claim 30, wherein the step of etching the first conductive layer includes the step of applying an acid resisting ink having dielectric properties to the first conductive layer, and wherein the acid resistant ink forms the dielectric layer.

35. The method according to claim 30, wherein the dielectric layer is in the range of about 1-10 microns.

36. The method according to claim 30, wherein the dielectric layer is in the range of about 2-4 microns.