Plating device and plating method
First Claim
1. A plating apparatus for plating an object to be plated such as an electronic component substrate, wherein the apparatus comprises appropriate numbers of a plating bath and baths for washing and the like and is constituted to continuously carry out plating, edge etching, washing and drying therein.
1 Assignment
0 Petitions
Accused Products
Abstract
A plating apparatus and plating method for an electronic component substrate or the like which prevent the spread of metal contamination in and out of the plating apparatus, do not dissolve a seed layer, have no defects caused by scattering of a treating liquid and wash only the perimeter of the electronic component substrate or the like are provided. The plating apparatus is a plating apparatus for plating an object to be plated such as an electronic component substrate. The plating apparatus includes appropriate numbers of plating baths and baths used for washing or other purposes therein and carries out plating, edge etching, washing and drying continuously therein.
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Citations
27 Claims
- 1. A plating apparatus for plating an object to be plated such as an electronic component substrate, wherein the apparatus comprises appropriate numbers of a plating bath and baths for washing and the like and is constituted to continuously carry out plating, edge etching, washing and drying therein.
Specification