Method for forming a product sensor, and a product sensor

• US 20030052077A1
• Filed: 09/19/2002
• Published: 03/20/2003
• Est. Priority Date: 03/31/2000
• Status: Active Grant

• Current Assignee: Intune Circuits Oy (Savisalo Family)
• Original Assignee: Rafsec Oy (UPM Kymmene OY)
• Inventors: Hanhikorpi, Marko
• Granted Patent: US 6,951,621 B2
• Time in Patent Office: Days
• US Class Current: 216/2
• CPC Class Codes: G08B 13/2414 using inductive tags
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: G08B 13/244 Tag manufacturing, e.g. continuous manufacturing processes
• CPC Class Codes: H05K 1/0293 Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/10181 Fuse
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

The invention relates to a method for forming a product sensor, and a product sensor. The product sensor is formed on a substrate and provided with at least one electric circuit comprising at least one capacitor and at least one coil. At least part of the electric circuit is formed by evaporating a first metallization layer at least at the electric circuit in the product sensor.

Claims

1. A method for forming a product sensor, which product sensor is formed on a substrate and provided with at least one electric circuit comprising at least one capacitor and at least one coil, at least part of the electric circuit is formed by applying a first conductive layer on the product sensor by evaporation, at least at the location of the electric circuit, wherein the production of the product sensor comprises:

a first plating step, in which a first conductive layer is evaporated on at least one surface of the substrate;

a step of adding an etching resist, in which the first conductive layer is coated with the etching resist in substantially other parts than at the electric circuit;

a step of adding a fuse mask, in which the fuse mask is inserted on the first conductive layer at the location of one or more fuses to be made;

a depositing step, in which a second conductive layer is deposited on those parts of the first conductive layer which do not contain electrolytic resist; and

an etching step, in which the electrolytic resist and that part of the first conductive layer which is under the electrolytic resist are removed substantially entirely.

2. The method according to claim 1, wherein the production of the product sensor consists of at least the following steps:

a first plating step, wherein the other parts of the electric circuit are formed, except for the fuse;

a step of forming an evaporation mask, wherein an evaporation mask is applied onto the first conductive layer, except for the location of one or more fuses to be provided in the product sensor; and

an evaporation step, in which a first conductive layer is evaporated on those parts of the first conductive layer which do not contain an evaporation mask.

3. The method of claim 1 or 2, wherein copper is used in the evaporation.

4. The method of claim 3, wherein aluminum is used in the evaporation.

5. A product sensor which comprises a substrate and is provided with at least one electric circuit comprising at least one capacitor and at least one coil, at least part of the electric circuit is formed by evaporating a first conductive layer on the product sensor, at least at the location of the electric circuit, wherein the production of the product sensor a first conductive layer is coated with the etching resist in substantially other parts than at the electric circuit, a fuse mask is inserted on the first conductive layer at the location of one or more fuses to be made, a second conductive layer is deposited on those parts of the first conductive layer which do not contain electrolytic resist, and the electrolytic resist and that part of the first conductive layer which is under the electrolytic resist are removed substantially entirely.

6. The product sensor of claim 5, wherein at least said coil and at least one plate in the capacitor is formed by depositing a second conductive layer onto said first conductive layer.

7. The product sensor of claim 6, which further comprises at least one fuse wherein a second conductive layer deposited on said first conductive layer is left undeposited substantially at the location of the fuse.

8. The product sensor of claim 5, 6 or 7, wherein copper is used in the evaporation.

9. The product sensor of claim 8, wherein aluminum is used in the evaporation.

10. The product sensor of claim 9, wherein it is arranged to be used as a product protection sensor.

11. The product sensor of claim 10, wherein it is arranged to be used as a detector.