×

Semiconductor device including molded wireless exposed drain packaging

  • US 20030052408A1
  • Filed: 09/24/2001
  • Published: 03/20/2003
  • Est. Priority Date: 04/13/2000
  • Status: Active Grant
First Claim
Patent Images

1. 1. A semiconductor device comprising:

  • a leadframe including a source pad and a gate pad, the leadframe further including a plurality of leads extending from the source pad and at least one lead extending from the gate pad;

    a die coupled to the leadframe;

    a drain pad coupled to a drain region of the die; and

    a body including a window defined therein and substantially enveloping the leadframe and die such that a surface of the drain pad opposite the die is exposed through the window.

View all claims
  • 8 Assignments
Timeline View
Assignment View
    ×
    ×