Optical switching apparatus and method for assembling same
First Claim
1. A method for assembling an optical networking device, the optical networking device comprising a mirror structure bonded to a substrate, the method comprising:
- forming a number of mechanical standoffs between the mirror structure and the substrate from a first material; and
forming a number of electrical contacts between the mirror structure and the substrate from a second solder material having a lower melting point than the first material;
bonding the mirror structure to the substrate under pressure at a temperature between the melting point of the first material and the melting point of the second solder material.
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Accused Products
Abstract
In an optical switching apparatus having a mirror structure bonded to a substrate, the gap between the mirror structure and the substrate is controlled by mechanical standoffs placed between the mirror structure and the substrate. The mirror structure is bonded to the substrate using solder. The mechanical standoffs are formed from a material having a higher melting point than that of the solder. The mirror structure is bonded to the substrate under pressure at a temperature between the melting point of the solder and the melting point of the mechanical standoffs.
100 Citations
20 Claims
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1. A method for assembling an optical networking device, the optical networking device comprising a mirror structure bonded to a substrate, the method comprising:
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forming a number of mechanical standoffs between the mirror structure and the substrate from a first material; and
forming a number of electrical contacts between the mirror structure and the substrate from a second solder material having a lower melting point than the first material;
bonding the mirror structure to the substrate under pressure at a temperature between the melting point of the first material and the melting point of the second solder material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An apparatus comprising:
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a number of mechanical standoffs formed from a first material for physically separating a mirror structure from a substrate by a predetermined distance; and
a number of electrical contacts formed from a second solder material having a lower melting point than the first material for bonding the mirror structure to the substrate. - View Dependent Claims (10, 11, 12)
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13. An optical switching apparatus comprising a mirror structure bonded to a substrate through the process of:
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forming a number of mechanical standoffs between the mirror structure and the substrate from a first material; and
forming a number of electrical contacts between the mirror structure and the substrate from a second solder material having a lower melting point than the first material; and
bonding the mirror structure to the substrate under pressure at a temperature between the melting point of the first solder material and the melting point of the second material. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification