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Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

  • US 20030054588A1
  • Filed: 12/03/2001
  • Published: 03/20/2003
  • Est. Priority Date: 12/07/2000
  • Status: Active Grant
First Claim
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1. A method for making a spatial light modulator, comprising:

  • providing a first wafer;

    providing a second wafer;

    forming circuitry and a plurality of electrodes on or in the first wafer;

    forming a plurality of deflectable elements on or in either the first or second wafer;

    bonding the first and second wafers together to form a wafer assembly; and

    separating the wafer assembly into individual wafer assembly dies.

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