Method and device for monitoring electric components in a pick-and-palce device for substrates
First Claim
1. A method for checking electric components (10) in a pick-and-place device for substrates (13), the components (10) being handled by a pick-and-place head (1) of the pick-and-place device which is made to travel in a working plane (x-y), a pick-up (2) for the components (10) being displaced in the pick-and-place head (1) perpendicularly in relation to the working plane (x-y) by means of a lift drive (3) between a transporting position and a functioning position, the component (10) being sucked against an underside of the pick-up (2), the component (10) being raised by the pick-up (2) from a pick-up position into the transporting position and, after the pick-and-place head (1) has been made to travel into a placement position, is lowered onto the substrate (13) into the functioning position, the positional relationship between the component (10) and the pick-up (2) being checked by an optical scanning means (7) of the pick-and-place head (1), the component (10) being brought by the lifting movement of the pick-up (2) into the active range of at least one scanning beam (22) of the scanning means (7) oriented transversely in relation to the lifting direction, in the transporting position, the underside of the pick-up (2) being located above the scanning beam (22), and the the pick-and-place head (1) having a control means (6), which checks the lifting position of the pick-up (2), characterized in that the scanning means (7) is coupled to the control means (6), in that the scanning means (7) is activated in a phase before and a phase after the suction attachment of the component (10), in that the control means (6) detects the presence or absence of the component (10) on the pick-up (2) from the scanning values of the scanning means (7), and in that the control means (6) assesses scanning values remaining the same between the two phases as operating errors.
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Accused Products
Abstract
The invention relates to a method and to a device for monitoring electric components in a pick and place device for substrates. The underside of a pick-up (2) is monitored by an optical scanning means (7) during the pick-up phase and during the placing phase of a component (10). A lift drive (3) for the pick-up (2) is provided with a position sensor (5) that is linked with a control device (6). The scanning means (7) emits and receives a scanning beam (22) oriented transversally to the direction of lift and is likewise coupled with the control device (6), thereby allowing to monitor the underside of the pick-up (2) in a direct time-related manner with the picking and placing of the component (10). The various lift positions are saved and compared when a threshold value of the received scanning beam (22) is exceeded so that the inventive device also allows for a monitoring of the height of the component.
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Citations
8 Claims
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1. A method for checking electric components (10) in a pick-and-place device for substrates (13),
the components (10) being handled by a pick-and-place head (1) of the pick-and-place device which is made to travel in a working plane (x-y), a pick-up (2) for the components (10) being displaced in the pick-and-place head (1) perpendicularly in relation to the working plane (x-y) by means of a lift drive (3) between a transporting position and a functioning position, the component (10) being sucked against an underside of the pick-up (2), the component (10) being raised by the pick-up (2) from a pick-up position into the transporting position and, after the pick-and-place head (1) has been made to travel into a placement position, is lowered onto the substrate (13) into the functioning position, the positional relationship between the component (10) and the pick-up (2) being checked by an optical scanning means (7) of the pick-and-place head (1), the component (10) being brought by the lifting movement of the pick-up (2) into the active range of at least one scanning beam (22) of the scanning means (7) oriented transversely in relation to the lifting direction, in the transporting position, the underside of the pick-up (2) being located above the scanning beam (22), and the the pick-and-place head (1) having a control means (6), which checks the lifting position of the pick-up (2), characterized in that the scanning means (7) is coupled to the control means (6), in that the scanning means (7) is activated in a phase before and a phase after the suction attachment of the component (10), in that the control means (6) detects the presence or absence of the component (10) on the pick-up (2) from the scanning values of the scanning means (7), and in that the control means (6) assesses scanning values remaining the same between the two phases as operating errors.
Specification