Integrated device based upon semiconductor technology, in particular chemical microreactor
First Claim
1. An integrated device comprising a semiconductor body having a high-temperature operating portion, a low-temperature operating portion, and thermal-insulation means, said thermal-insulation means including dissipator means arranged between said high-temperature operating portion and said low-temperature operating portion.
2 Assignments
0 Petitions
Accused Products
Abstract
An integrated device based upon semiconductor technology, in particular a chemical microreactor, including a semiconductor body having a high-temperature operating portion and a low-temperature operating portion. The semiconductor body is provided with a thermal-insulation device including a dissipator element arranged between the high-temperature operating portion and the low-temperature operating portion. The dissipator includes a membrane connecting the high-temperature operating portion and the low-temperature operating portion, and a plurality of diaphragms that extend substantially orthogonal to the membrane and are parallel to one another.
89 Citations
34 Claims
- 1. An integrated device comprising a semiconductor body having a high-temperature operating portion, a low-temperature operating portion, and thermal-insulation means, said thermal-insulation means including dissipator means arranged between said high-temperature operating portion and said low-temperature operating portion.
-
14. An encapsulated integrated device comprising:
-
a die including at least one semiconductor body;
a protective polycarbonate layer, carried by said die; and
a supporting plate, said die being carried by said supporting plate. - View Dependent Claims (15)
-
-
16. An integrated device formed through microelectronic fabrication techniques, the integrated device comprising at least one microreactor, each of the at least one microreactors including:
-
a body having a first portion, a second portion, and a mid-portion positioned between the first and second portions;
a hydraulic circuit including;
an inlet for receiving a fluid;
a channel fluidly linked to the inlet and positioned in the first portion of the body;
an outlet fluidly linked to the channel; and
an outlet reservoir fluidly linked to the outlet;
a heating element positioned in the first portion of the body and thermally linked to the channel; and
a heat dissipator positioned in the mid-portion of the body and thermally linked to the outlet to substantially block propagation of heat from the heating element to the second portion of the body. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 31, 32, 34)
-
-
30. An integrated device formed through microelectronic fabrication techniques, the integrated device comprising:
-
a body having a first portion, a second portion, and a mid-portion positioned between the first and second portions;
a heat source positioned in the first portion of the body; and
a heat dissipator positioned in the mid-portion of the body to substantially block propagation of heat from the at least one heat source to the second portion of the body. - View Dependent Claims (33)
-
Specification