Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems

• US 20030057260A1
• Filed: 08/05/2002
• Published: 03/27/2003
• Est. Priority Date: 02/23/1998
• Status: Active Grant

• Current Assignee: Alan G. Wood, David R. Hembree, John O. Jacobson, Michael E. Hess, Warren M. Farnworth
• Original Assignee: Alan G. Wood, David R. Hembree, John O. Jacobson, Michael E. Hess, Warren M. Farnworth
• Inventors: Farnworth, Warren M., Hembree, David R., Wood, Alan G., Hess, Michael E., Jacobson, John O.
• Granted Patent: US 6,851,597 B2
• Time in Patent Office: Days
• US Class Current: 228/110.1
• CPC Class Codes: B23K 20/10 making use of vibrations, e.g. ultrasonic welding
• CPC Class Codes: B23K 2101/38 Conductors

Abstract

A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

Claims

1. A method for forming a connection comprising:

providing a semiconductor die having a bond pad on a surface thereof;

providing an interconnect having a contact member on a connection surface thereof, said contact member for penetrating a layer of material on an outer surface of said bond pad for connecting said contact member to said bond pad of said semiconductor;

bringing together said first surface of said semiconductor die and said connection surface of said interconnect having said contact member aligned proximate said bond pad on said first surface of said semiconductor die;

engaging said semiconductor die and said interconnect using a force; and

substantially ultrasonically vibrating one of said semiconductor die and said interconnect using vibrational energy having said contact member of said interconnect penetrating a portion of said bond pad of said semiconductor die forming an electrical connection.

2. The method of claim 1, whereby said engaging and said ultrasonic vibration are continued having said contact member penetrating said portion of said bond pad to a predetermined depth.

3. The method of claim 2, wherein said predetermined depth comprises a range of about 0.3-0.8 of a thickness of said bond pad.

4. The method of claim 2, wherein said ultrasonic vibration is conducted to achieve a vibrational amplitude in the range of about 5 to about 30 percent of said predetermined depth.

5. The method of claim 1, wherein said ultrasonic vibration is conducted in the range of about 5 to about 200 milliseconds.

6. The method of claim 2, further comprising:

detecting penetration of said bond pad to said predetermined depth by detection/feedback apparatus.

7. The method of claim 6, further comprising:

terminating said penetration of said bond pad on said surface of said semiconductor die by detecting said penetration of said bond pad to said predetermined depth by said detection/feedback apparatus.

8. The method of claim 1, wherein said electrical connection comprises a non-permanent electrical connection between said bond pad and said contact member.

9. The method of claim 1, wherein said electrical connection comprises a permanent electrical connection between said bond pad and said contact member.

10. The method of claim 1, further comprising:

retracting said semiconductor die and said interconnect from each other during application of a linear axial ultrasonic vibrational force to one of said semiconductor die and said interconnect, said retracting for disconnecting said semiconductor die from said interconnect.

11. A method for forming connections comprising:

providing a semiconductor die having a bond pad on a surface thereof;

providing an interconnect having a contact member on a connection surface thereof, said at least one contact member for penetrating a layer of material on an outer surface of said bond pad for connecting said contact member to said at least one bond pad of said semiconductor die;

bringing together the surface of the semiconductor die and the connection surface of the interconnect having said contact member aligned proximate said bond pad on said surface of said semiconductor die;

engaging said semiconductor die and said interconnect by applying a force; and

substantially ultrasonically vibrating one of said semiconductor die and said interconnect using vibrational energy having said contact member of said interconnect penetrating a portion of said bond pad of said semiconductor die forming an electrical connection.

12. The method of claim 11, whereby said engaging and said ultrasonic vibration are continued having said contact member penetrating said portion of said bond pad to a predetermined depth.

13. The method of claim 12, wherein said predetermined depth comprises a range of about 0.3-0.8 of a thickness of said bond pad.

14. The method of claim 12, wherein said ultrasonic vibration is conducted to achieve a vibrational amplitude in the range of about 5 to about 30 percent of said predetermined depth.

15. The method of claim 11, wherein said ultrasonic vibration is conducted in the range of about 5 to about 200 milliseconds.

16. The method of claim 12, further comprising:

detecting penetration of said bond pad to the predetermined depth by detection/feedback apparatus.

17. The method of claim 16, further comprising:

terminating the penetration of said bond pad on said surface of said semiconductor die by detecting the penetration of said bond pad to the predetermined depth by said detection/feedback apparatus.

18. The method of claim 11, wherein said electrical connection comprises a non-permanent electrical connection between said bond pad and said contact member.

19. The method of claim 11, wherein said electrical connection comprises a permanent electrical connection between said bond pad and said contact member.

20. The method of claim 11, further comprising:

retracting said semiconductor die and said interconnect from each other during application of a linear axial ultrasonic vibrational force to one of said semiconductor die and said interconnect, said retracting for disconnecting said semiconductor die from said interconnect.