Forming interconnects
First Claim
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1. A method for forming an electronic device, comprising:
- forming a first conductive or semiconductive layer;
forming a sequence of at least one insulating layer and at least one semiconducting layer over the first conductive or semiconductive layer;
locally depositing solvents at a localised region of the insulating layer so as to dissolve the sequence of insulating and semiconducting layers in the region to leave a void extending through the sequence of layers; and
depositing conductive or semiconductive material in the void.
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Abstract
A method for forming an electronic device, comprising: forming a first conductive or semiconductive layer; forming a sequence of at least on insulating layer and at least one semiconducting layer over the first conductive or semiconductive layer; locally depositing solvents at a localised region of the insulating layer so as to dissolve the sequence of insulating and semiconducting layers in the region to leave a void extending through the sequence of layer; and depositing conductive or semiconductive material in the void.
106 Citations
49 Claims
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1. A method for forming an electronic device, comprising:
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forming a first conductive or semiconductive layer;
forming a sequence of at least one insulating layer and at least one semiconducting layer over the first conductive or semiconductive layer;
locally depositing solvents at a localised region of the insulating layer so as to dissolve the sequence of insulating and semiconducting layers in the region to leave a void extending through the sequence of layers; and
depositing conductive or semiconductive material in the void. - View Dependent Claims (2, 3, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 42, 43, 44, 45, 46, 47, 48, 49)
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4. A method for forming an electronic device, comprising:
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forming a first conductive or semiconduconductive layer;
forming a soluble insulating layer over the first conductive or semiconductive layer;
locally depositing a solvent at a localised region of the insulating layer so as to dissolve the first insulating layer in the region to leave a void extending through the insulating layer; and
depositing conductive or semiconductive material in the void.
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39. A method for forming an electronic device, comprising:
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forming a first conductive or semiconductive layer;
forming a sequence of insulating and semiconducting layers over the first conductive or semiconductive layer;
locally depositing a diffusive dopant from solution at a localised region of the insulating layer so as to modify the insulating and semiconducting layers in the region and thereby form a channel of electrically conductive material extending through the sequence of layers. - View Dependent Claims (40, 41)
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Specification