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Forming interconnects

  • US 20030060038A1
  • Filed: 06/21/2002
  • Published: 03/27/2003
  • Est. Priority Date: 12/21/1999
  • Status: Active Grant
First Claim
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1. A method for forming an electronic device, comprising:

  • forming a first conductive or semiconductive layer;

    forming a sequence of at least one insulating layer and at least one semiconducting layer over the first conductive or semiconductive layer;

    locally depositing solvents at a localised region of the insulating layer so as to dissolve the sequence of insulating and semiconducting layers in the region to leave a void extending through the sequence of layers; and

    depositing conductive or semiconductive material in the void.

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