Electrode structure including encapsulated adhesion layer

• US 20030062551A1
• Filed: 10/01/2002
• Published: 04/03/2003
• Est. Priority Date: 10/02/2001
• Status: Abandoned Application

• Current Assignee: JDS Uniphase Corporation (Lumentum Holdings Inc.)
• Original Assignee: JDS Uniphase Corporation (Lumentum Holdings Inc.)
• Inventors: Chen, Xingfu
• Application Number:
  US10/261,877
• Publication Number:
  US 20030062551A1
• Time in Patent Office: Days
• US Class Current: 257/211
• CPC Class Codes: G02F 1/0316 Electrodes

Abstract

The present invention relates to methods for forming metalized structures, such as electrodes, on non-conductive substrates of electronic and electro-optic devices for enhanced corrosion resistance. In the method of the present invention, an electrode layer is deposited over an adhesion layer on a substrate surface including all edges of the adhesion layer not in contact with the substrate, thereby encapsulating the adhesion layer within the electrode metal before forming the electrode. Prior art multi-layer metalized structures have a galvanic corrosion problem when exposed to moisture, owing to the differences in electrochemical potentials of the dissimilar metals. Galvanic corrosion cells are created at areas of water condensation during device service. Such galvanic corrosion can cause current leakage, short circuit, or other problems causing device failures. By encapsulating all surfaces of the adhesion layer not in contact with the substrate, in accordance with the present invention, galvanic corrosion can be prevented.

Claims

1. A multilayer metalized structure comprising:

a first adhesion layer of a first metal deposited on a substrate;

a second encapsulation layer of a second metal deposited upon the first layer, such that the second layer covers all edges of the first layer not in contact with the substrate.

2. A multiplayer metalized structure as defined in claim 1, wherein the substrate is selected from lithium niobate, lithium tantalite, silicon and gallium arsenide.

3. A multiplayer metalized structure as defined in claim 2, wherein the first adhesion layer is selected from chromium, titanium, titanium-tungsten, aluminum, nickel-chromium, tantalum, vanadium, and molybdenum.

4. A multiplayer metalized structure as defined in claim 3, wherein the encapsulation layer is selected from gold, copper, silver, platinum, and their alloys.

5. A multilayer electrode structure on a semiconductor device comprising:

a first adhesion layer of a first metal deposited on a substrate;

a second encapsulation layer of a second metal deposited upon the first layer, such that the second layer covers all edges of the first layer not in contact with the substrate;

an electrode layer of the second metal covering the encapsulation layer.

6. A multilayer electrode structure as defined in claim 5, wherein the substrate is selected from lithium niobate, lithium tantalite, silicon and gallium arsenide.

7. A multilayer electrode structure as defined in claim 6, wherein the first metal is selected from chromium, titanium, titanium-tungsten, aluminum, nickel-chromium, tantalum, vanadium, and molybdenum.

8. A multilayer electrode structure as defined in claim 7, wherein the second metal is selected from gold, copper, silver, platinum, and their alloys.

9. A method of forming a metalized structure on a substrate comprising the steps of:

depositing an adhesion layer of a first metal on a surface of the substrate;

etching the adhesion layer selectively to define contact areas;

depositing an encapsulation layer of a second metal on the surface of the substrate and upon the adhesion layer, such that the encapsulation layer covers all edges of the adhesion layer not in contact with the substrate;

fabricating a metalized structure over the encapsulation layer in the contact areas, the metalized structure being formed of a metal identical to or or having similar electrochemical potential to the encapsulation layer;

etching the encapsulation layer about the metalized structures in the contact areas.

10. The method as defined in claim 9, further including the deposition of an anti-oxidation layer over the adhesion layer, prior to the etching step to define contact areas.

11. The method as defined in claim 10, wherein the anti-oxidation layer comprises the second metal identical to the encapsulation layer.