Arrangements to supply power to semiconductor package

• US 20030062602A1
• Filed: 09/28/2001
• Published: 04/03/2003
• Est. Priority Date: 09/28/2001
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Frutschy, Kristopher, Chung, Chee-Yee, Sankman, Bob
• Granted Patent: US 7,173,329 B2
• Time in Patent Office: Days
• US Class Current: 257/666
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/49805 the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

Arrangements are used to supply power to a semiconductor package.

Claims

1. A perimeter frame attached to a perimeter of a substrate on one of a perimeter-side and a die-side of the substrate, the perimeter frame arranged to provide an electrical function to the substrate.

2. A frame as claimed in claim 1, in which the electrical function being one of ground, power, and capacitance.

3. A frame as claimed in claim 1, the frame being attached in multiple parts.

4. A frame as claimed in claim 1, in which the substrate is one of a thick-core, a thin-core, and a coreless substrate in one of a ceramic, a flex, and an integrated circuit printed circuit board (IC-PCB) carrier package.

5. A frame as claimed in claim 4, the package being one of a pinned grid array (PGA), and a ball grid array (BGA) carrier package.

6. A frame as claimed in claim 4, the package being one of a flip chip pin grid array (FCPGA), and a flip chip ball grid array (FC-BGA) carrier package.

7. A frame as claimed in claim 1, the frame substantially made of one of electrically conductive, insulating, and electrically conductive and insulating sections, and formed as one of a molded, stamped, etched, extruded and deposited frame, and is capable of withstanding temperatures of at least normal IC operation.

8. A frame as claimed in claim 7, the sections further being thermally conductive.

9. A frame as claimed in claim 8, the frame being adapted to at least partially support a heat sink.

10. A frame as claimed in claim 8, the frame having an integrated cooling structure.

11. A stiffener frame attached to a perimeter of a substrate on one of a perimeter-side and die-side of the substrate, the stiffener providing double electrical function to the substrate.

12. A frame as claimed in claim 11, in which the double electrical function being ones of ground, power, and capacitance.

13. A frame as claimed in claim 11, the frame being attached in multiple parts.

14. A frame as claimed in claim 11, the substrate being one of a thin-core, and a coreless substrate of a ceramic, a flex, and an integrated circuit printed circuit board (IC-PCB) carrier package.

15. A frame as claimed in claim 14, the package being one of a pinned grid array (PGA), and a ball grid array (BGA) carrier package.

16. A frame as claimed in claim 14, the package being one of a flip chip pin grid array (FCPGA), and a flip chip ball grid array (FC-BGA) carrier package.

17. A frame as claimed in claim 11, the frame substantially made of one of electrically conductive, insulating, and mixed electrically conductive and insulating sections, and formed as one of a molded, stamped, etched, extruded and deposited frame, and is capable of withstanding temperatures of at least normal IC operation.

18. A frame as claimed in claim 17, the sections further being thermally conductive.

19. A frame as claimed in claim 17, the frame being adapted to at least partially support a heat sink.

20. A frame as claimed in claim 17, the frame being having an integrated cooling structure.

21. A carrier package comprising:

one of a thick, a thin-core, and a coreless substrate of one of a ceramic, a flex, and an integrated circuit printed circuit board (IC-PCB) package; and

a perimeter frame attached to a perimeter of the substrate on one of a perimeter-side and a die-side of the substrate, the perimeter frame arranged to provide an electrical function to the substrate.

22. A carrier package as claimed in claim 21, in which the electrical function being one of ground, power, and capacitance.

23. A carrier package as claimed in claim 21, the frame being attached in multiple parts.

24. A carrier package as claimed in claim 21, the package being one of a pinned grid array (PGA), and a ball grid array (BGA) carrier package.

25. A carrier package as claimed in claim 21, the package being one of a flip chip pin grid array (FC-PGA), and a flip chip ball grid array (FC-BGA) carrier package.

26. A carrier package as claimed in claim 21, the frame substantially made of one of an electrically conductive, insulating, and electrically conductive and insulating sections, and formed as one of a molded, stamped, etched, extruded and deposited frame, and is capable of withstanding temperatures of at least normal IC operation.

27. A carrier package as claimed in claim 26, the sections further being thermally conductive.

28. A carrier package as claimed in claim 26, the frame being adapted to at least partially support a heat sink.

29. A carrier package as claimed in claim 26, the frame having an integrated cooling structure.

30. A carrier package comprising:

one of a thin-core, and a coreless substrate of one of a ceramic, a flex, and an IC-PCB package; and

a stiffener frame attached to a perimeter of the substrate on one of a perimeter-side and die side of the substrate, the stiffener providing double electrical function to the substrate.

31. A carrier package as claimed in claim 30, in which the double electrical function being ones of ground, power, and capacitance.

32. A carrier package as claimed in claim 30, the frame being attached in multiple parts.

33. A carrier package as claimed in claim 30, the package being one of a pinned grid array (PGA), and a ball grid array (BGA) carrier package.

34. A carrier package as claimed in claim 30, the package being one of a flip chip pin grid array (FC-PGA), and a flip chip ball grid array (FC-BGA) carrier package.

35. A carrier package as claimed in claim 30, the frame substantially made of one of an electrically conductive, insulating, and electrically conductive and insulating sections, and formed as one of a molded, stamped, etched, extruded and deposited frame, and is capable of withstanding temperatures of at least normal IC operation.

36. A carrier package as claimed in claim 35, the sections further being thermally conductive.

37. A carrier package as claimed in claim 35, the frame being adapted to at least partially support a heat sink.

38. A carrier package as claimed in claim 35, the frame having an integrated cooling structure.

39. A packaged integrated circuit (IC) comprising:

one of a ceramic, flex, and an integrated circuit printed circuit board (IC-PCB) carrier package including one of a thick, thin-core, and coreless substrate; and

a perimeter frame attached to a perimeter of the substrate on one of a perimeter-side and a die-side of the substrate, the perimeter frame arranged to provide an electrical function to the substrate.

40. A packaged IC as claimed in claim 39, in which the electrical function being one of ground, power, and capacitance.

41. A packaged IC as claimed in claim 39, the frame being attached in multiple parts.

42. A packaged IC as claimed in claim 39, the package being one of a pinned grid array (PGA), and a ball grid array (BGA) carrier package.

43. A packaged IC as claimed in claim 39, the package being one of a flip chip pin grid array (FC-PGA), and a flip chip ball grid array (FC-BGA) carrier package.

44. A packaged IC as claimed in claims 39, the frame substantially made of one of an electrically conductive, insulating, and electrically conductive and insulating sections, and formed as one of a molded, stamped, etched, extruded and deposited frame, and is capable of withstanding temperatures of at least normal IC operation.

45. A packaged IC as claimed in claim 44, the sections further being thermally conductive.

46. A packaged IC as claimed in claim 44, the frame being adapted to at least partially support a heat sink.

47. A packaged IC as claimed in claim 44, the frame having an integrated cooling structure.

48. A packaged integrated circuit (IC) comprising:

one of a ceramic, flex, and an integrated circuit printed circuit board (IC-PCB) carrier package including one of a thick, thin-core, and coreless substrate; and

a stiffener frame attached to a perimeter of a substrate on one of a perimeter-side and die-side of the substrate, the stiffener providing double electrical function to the substrate.

49. A packaged IC as claimed in claim 48, in which the double electrical function being ones of ground, power, and capacitance.

50. A packaged IC as claimed in claim 48, the frame being attached in multiple parts.

51. A packaged IC as claimed in claim 48, the package being one of a pinned grid array (PGA), and a ball grid array (BGA) carrier package.

52. An packaged IC as claimed in claim 48, the package being one of a flip chip pin grid array (FC-PGA), and a flip chip ball grid array (FC-BGA) carrier package.

53. A packaged IC as claimed in claim 48, the frame substantially made of an electrically conductive, insulating, and electrically conductive and insulating sections, and formed as one of a molded, stamped, etched, extruded and deposited frame, and is capable of withstanding temperatures of at least normal IC operation.

54. An packaged IC as claimed in claim 53, the sections further being thermally conductive.

55. A packaged IC as claimed in claim 53, the frame being adapted to at least partially support a heat sink.

56. A packaged IC as claimed in claim 53, the frame having an integrated cooling structure.

57. A method for providing electrical function from a perimeter side of a substrate to a dieside of a substrate, which comprises:

(a) providing external power to perimeter frame attached to perimeter of a substrate,

(b) conducting electrical function from perimeter frame, through perimeter frame-substrate interface, through substrate, through substrate-die interface, to die.

58. A method as claimed in claim 57, where electrical function further comprises one of power and ground.

59. A method as claimed in claim 57, where perimeter frame also provides stiffening support.

60. A method for providing power from perimeter side of a substrate to a die-side of a substrate, which comprises:

(a) providing perimeter frame capacitance attached to perimeter of a substrate ,

(b) conducting power from perimeter frame capacitance, through perimeter frame substrate interface, through substrate, through substrate-die interface, to die.

61. A method as claimed in claim 60, where electrical function further comprises one of power and ground

62. A method as claimed in claim 60, where perimeter frame capacitance also provides stiffening support.