Method of manufacturing electronic tag

• US 20030063002A1
• Filed: 09/27/2002
• Published: 04/03/2003
• Est. Priority Date: 09/28/2001
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Hitachi, Ltd.
• Inventors: Ikeda, Yuji, Saito, Takeshi, Morinaga, Yuichi, Okamoto, Michio
• Granted Patent: US 6,762,682 B2
• Time in Patent Office: Days
• US Class Current: 340/572.7
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: G08B 13/244 Tag manufacturing, e.g. continuous manufacturing processes
• CPC Class Codes: H01L 2224/023 Redistribution layers [RDL] for bonding areas
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05556 in side view
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/48699 Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 : Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: Y10T 29/49018 : with other electrical component
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing

Abstract

In the event of the shipment of electronic tags from a manufacturer to a customer, a number of the electronic tags required by the customer are adhered to a double-faced adhesive tape and then the double-faced adhesive tape is wound on a reel. Then, this reel is contained in a case and shipped to the customer. The electronic tag is adhered to an article in the following manner. That is, the double-faced adhesive tape is cut to obtain pieces of the electronic tags, and the cover tape on the rear surface of the double-faced adhesive tape is peeled, and then, the electronic tag is adhered to the article by the use of the double-faced adhesive tape.

Claims

1. An electronic tag, comprising:

a conductor piece constituting an antenna;

a slit formed in a part of the conductor piece and having an end extending to an outer edge of the conductor piece;

a semiconductor chip mounted on the conductor piece near the slit;

a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the conductor piece facing to a semiconductor chip mounting area across the slit; and

resin for covering a part of the conductor piece in which the slit is formed.

2. The electronic tag according to claim 1,

wherein the semiconductor chip and the wire are sealed with the resin.

3. The electronic tag according to claim 2,

wherein the resin includes a potting resin.

4. The electronic tag according to claim 1,

wherein the resin covers only one surface of the conductor piece.

5. An electronic tag, comprising:

a conductor piece constituting an antenna;

a slit formed in a part of the conductor piece and having an end extending to an outer edge of the conductor piece;

a semiconductor chip mounted on the conductor piece near the slit;

a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the conductor piece facing to a semiconductor chip mounting area across the slit; and

resin for sealing the semiconductor chip and the wire,

wherein the slit extends in a direction diagonal to the extending direction of the outer edge of the conductor piece.

6. An electronic tag, comprising:

a conductor piece constituting an antenna;

a slit formed in a part of the conductor piece and having an end extending to an outer edge of the conductor piece;

a semiconductor chip mounted on the conductor piece near the slit;

a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the conductor piece facing to a semiconductor chip mounting area across the slit; and

resin for sealing the semiconductor chip and the wire,

wherein the one end of the wire is electrically connected to a bump electrode formed on a device forming area of the semiconductor chip.

7. The electronic tag according to claim 6

wherein an organic insulating film is formed on the device forming area of the semiconductor chip, and the bump electrode is formed on the organic insulating film.

8. An electronic tag, comprising:

a conductor piece constituting an antenna;

a slit formed in a part of the conductor piece and having an end extending to an outer edge of the conductor piece;

a semiconductor chip mounted on the conductor piece near the slit;

a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the conductor piece facing to a semiconductor chip mounting area across the slit; and

resin for sealing the semiconductor chip and the wire,

wherein a rear surface of the semiconductor chip is electrically connected to the conductor piece.

9. An electronic tag, comprising:

a conductor piece constituting an antenna;

a slit formed in a part of the conductor piece and having an end extending to an outer edge of the conductor piece;

a semiconductor chip mounted on the conductor piece near the slit;

a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the conductor piece facing to a semiconductor chip mounting area across the slit; and

resin for sealing the semiconductor chip and the wire,

wherein a width of the slit is narrower than that of the conductor piece near the slit.

10. An electronic tag, comprising:

a rectangular conductor piece constituting an antenna;

a slit formed in a part of the conductor piece and having an end extending to an outer edge of the conductor piece;

a semiconductor chip mounted on the conductor piece near the slit;

a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the conductor piece facing to a semiconductor chip mounting area across the slit; and

resin for sealing the semiconductor chip and the wire,

wherein a planar shape of the resin is a rectangle having a longitudinal length of the conductor piece longer than the lateral length thereof.

11. The electronic tag according to claim 10,

wherein a part of the conductor piece in which the slit is formed is covered with the resin.

13. The electronic tag according to claim 11,

wherein the resin includes a potting resin.

14. The electronic tag according to claim 11,

wherein the resin includes a molding resin.

12. An electronic tag, comprising:

a conductor piece constituting an antenna;

a slit formed in a part of the conductor piece and having an end extending to an outer edge of the conductor piece;

a semiconductor chip mounted on the conductor piece near the slit;

a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the conductor piece facing to a semiconductor chip mounting area across the slit; and

resin for sealing the semiconductor chip and the wire,

wherein the resin covers only one surface of the conductor piece.

15. A method of manufacturing an electronic tag, which is provided with a rectangular lead constituting an antenna;

a slit formed in a part of the lead and having an end extending to an outer edge of the lead;

a semiconductor chip mounted on the lead near the slit;

a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the lead facing to a semiconductor chip mounting area across the slit; and

resin for sealing the semiconductor chip and the wire,

the method comprising the steps of;

(a) preparing a lead frame in which a plurality of leads are arranged in parallel to each other, and both longitudinal ends of the leads are held by a pair of support frames extending in a direction perpendicular to the longitudinal direction of the lead;

(b) mounting a semiconductor chip on each of the leads;

(c) connecting the lead and the semiconductor chip with a wire;

(d) sealing the semiconductor chip and the wire with resin; and

(e) cutting both ends of the respective leads to separate the leads from the support frames.

16. The method of manufacturing an electronic tag according to claim 15,

wherein no support frame extending in the longitudinal direction of the lead is provided between the respective leads.

17. A method of manufacturing an electronic tag, comprising a first step of adhering a predetermined number of electronic tags each having a semiconductor chip formed on a part of a conductor piece constituting an antenna to an entire surface of a double-faced adhesive tape;

and a second step of packaging the double-faced adhesive tape to which the electronic tags are adhered, and then shipping the same.

18. The method of manufacturing an electronic tag according to claim 17,

wherein a surface area of the adhesive applied to the double-faced adhesive tape is made smaller than that of the conductor piece.

19. The method of manufacturing an electronic tag according to claim 17,

wherein perforations are provided to the double-faced adhesive tape around the area to which the electronic tag is adhered.

20. The method of manufacturing an electronic tag according to claim 17,

wherein, when adhering the electronic tags to the double-faced adhesive tape, the electronic tags are oriented so that the longitudinal direction of the conductor piece and that of the double-faced adhesive tape are parallel to each other.

21. The method of manufacturing an electronic tag according to claim 17,

wherein the double-faced adhesive tape to which the electronic tags are adhered is folded in a zigzag fashion and then shipped.

22. The method of manufacturing an electronic tag according to claim 17,

wherein the double-faced adhesive tape to which the electronic tags are adhered is wound on a reel and then shipped.

23. A method of manufacturing an electronic tag, comprising the steps of:

(a) preparing a lead frame to which a plurality of leads each constituting an antenna of an electronic tag are connected via support frames;

(b) mounting a semiconductor chip on each of the leads of the lead frame, and then electrically connecting the lead to the semiconductor chip;

(c) sealing the semiconductor chip mounted on each of the leads with resin, thereby manufacturing the electronic tag;

(d) after the step (c), adhering the lead frame to an entire surface of the double-faced adhesive tape;

(e) after the step (d), cutting the support frames of the lead frame to remove the same;

(f) checking the quality of the electronic tags, which are adhered to the entire surface of the double-faced adhesive tape and electrically isolated from each other; and

(g) after the step (f), packaging the double-faced adhesive tape to which the electronic tags are adhered, and then shipping the same.

24. The method of manufacturing an electronic tag according to claim 23,

wherein the double-faced adhesive tape to which the electronic tags are adhered is folded in a zigzag fashion and then shipped.

25. The method of manufacturing an electronic tag according to claim 23,

wherein the double-faced adhesive tape to which the electronic tags are adhered is wound on a reel and then shipped.

26. A method of manufacturing an electronic tag, comprising the steps of:

(a) preparing a lead frame to which a plurality of leads each constituting an antenna of an electronic tag are connected via support frames;

(b) mounting a semiconductor chip on each of the leads on the lead frame, and then electrically connecting the lead to the semiconductor chip;

(c) sealing the semiconductor chip mounted on each of the leads with resin, thereby manufacturing the electronic tag;

(d) after the step (c), cutting the support frames of the lead frame to remove the same, thereby obtaining pieces of the electronic tags;

(e) checking the quality of the pieces of the electronic tags;

(f) after the step (e), adhering a predetermined number of electronic tags to an entire surface of a double-faced adhesive tape; and

(g) packaging the double-faced adhesive tape to which a predetermined number of the electronic tags are adhered, and then shipping the same.

27. The method of manufacturing an electronic tag according to claim 26,

wherein the double-faced adhesive tape to which the electronic tags are adhered is folded in a zigzag fashion and then shipped.

28. The method of manufacturing an electronic tag according to claim 26,

wherein the double-faced adhesive tape to which the electronic tags are adhered is wound on a reel and then shipped.