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Negative resist process with simultaneous development and chemical consolidation of resist structures

  • US 20030064327A1
  • Filed: 07/01/2002
  • Published: 04/03/2003
  • Est. Priority Date: 06/29/2001
  • Status: Active Grant
First Claim
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1. A process for producing amplified negative resist structures, which comprises:

  • applying a chemically amplified resist to a substrate, the resist including;

    a polymer having a polarity and containing an acid-labile group and a bound anchor group, the acid-labile group being eliminatable by acid and being able to liberate the anchor group to change the polarity of the polymer;

    a photoacid generator; and

    a first solvent;

    removing the solvent to yield a photosensitive resist film;

    exposing sections of the photosensitive resist film to generate an acid from the photoacid generator in the exposed sections of the resist film;

    contrasting the exposed resist film by eliminating the acid-labile group of the polymer with the acid and liberating the anchor group in the exposed sections of the resist film to change the polarity of the polymer;

    developing the exposed and contrasted resist film with a developer, the developer including;

    a second solvent for dissolving the polymer containing acid-labile groups and not dissolving and not swelling the polymer containing the liberated anchor groups are liberated;

    an amplifying agent having a reactive group for coordinating the anchor groups of the polymer, and a polycyclic aliphatic group; and

    removing excess of the developer.

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