Encapsulation of a display element and method of forming the same

• US 20030066311A1
• Filed: 12/28/2001
• Published: 04/10/2003
• Est. Priority Date: 10/09/2001
• Status: Abandoned Application

• Current Assignee: Delta Electronics Public Limited (Valmont Industries Incorporated)
• Original Assignee: Delta Electronics Public Limited (Valmont Industries Incorporated)
• Inventors: Li, Chien-Hsing, Chen, Chun-Chien, Tsai, Jiun-Wei, Chen, Lai-Cheng, Yeh, Cheng-Nan
• Application Number:
  US10/028,673
• Publication Number:
  US 20030066311A1
• Time in Patent Office: Days
• US Class Current: 65/43
• CPC Class Codes: C03C 27/06 Joining glass to glass by processes other than fusing fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/8428 Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
• CPC Class Codes: H10K 50/87 Arrangements for heating or cooling
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8723 Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
• CPC Class Codes: H10K 59/8794 Arrangements for heating and cooling

Abstract

A display element has a luminescent body formed on a glass substrate, a glass cap with the rim bonded to the rim of the glass substrate, and a sealing layer of frit formed on the bonding region between the glass substrate and the glass cap. In encapsulating, the display element is placed between a pedestal an a pressing plate, and then a high-power laser beam is provided to penetrate the glass cap to focus on the sealing layer, resulting in sintering frit. Also, pressure is applied to the pedestal and the pressing plate.

Claims

1. A display element comprising:

a glass substrate with an top surface on which a luminescent body is formed;

a glass cap with a bottom surface on which the rim is bonded to the rim of the top surface of the glass substrate to create an airtight space; and

a sealing layer formed on the bonding region between the glass substrate and the glass cap, wherein the sealing layer is frit.

2. The display element according to claim 1, wherein the sealing layer comprises spacers embedded in frit.

3. The display element according to claim 1, further comprising a rib structure formed on the bottom surface of the glass cap, surrounded by the sealing layer and surrounding the luminescent body.

4. The display element according to claim 3, wherein the rib structure is frit.

5. The display element according to claim 3, wherein the rib structure is of ceramic materials.

6. The display element according to claim 1, further comprising a concavity on the bottom surface of the glass cap and positioned corresponding to the luminescent body.

7. The display element according to claim 1, wherein the display element is used in an organic light emitting diode (OLED).

8. The display element according to claim 1, wherein the display element is used in a plastic light emitting diode (PLED).

9. The display element according to claim 1, wherein the luminescent body is at least laminated with an anode layer, an organic luminescent layer and a cathode layer.

10. A method of encapsulating a display element, comprising steps of:

providing a display element, which has a luminescent body formed on a glass substrate, a glass cap with the rim bonded to the rim of the glass substrate, and a sealing layer of frit formed on the bonding region between the glass substrate and the glass cap;

providing a pedestal on which the display element is placed;

providing a pressing plate disposed on the display element;

providing a high-power beam which penetrates the glass cap to focus on the sealing layer so as to sinter frit; and

applying pressure on the pedestal and the pressing plate.

11. The method of encapsulating the display element according to claim 10, wherein the pedestal and the pressing plate are metal materials with good thermal conductivity.

12. The method of encapsulating the display element according to claim 10, wherein the high-power beam is a laser beam.

13. The method of encapsulating the display element according to claim 12, wherein the laser beam has a wavelength of more than 550 nm.

14. The method of encapsulating the display element according to claim 10, wherein the high-power beam is an infrared ray.

15. The method of encapsulating the display element according to claim 14, wherein the infrared ray has a wavelength of more than 800 nm.

16. The method of encapsulating the display element according to claim 10, wherein the sealing layer comprises spacers embedded in frit.

17. The method of encapsulating the display element according to claim 10, wherein the display element comprises a rib structure formed on the bottom surface of the glass cap, surrounded by the sealing layer and surrounding the luminescent body.

18. The method of encapsulating the display element according to claim 17, wherein the rib structure is frit.

19. The method of encapsulating the display element according to claim 17, wherein the rib structure is of ceramic materials.

20. The method of encapsulating the display element according to claim 10, the display element comprises a concavity formed on the bottom surface of the glass cap and positioned corresponding to the luminescent body.

21. The method of encapsulating the display element according to claim 10, wherein the display element is used in an organic light emitting diode (OLED).

22. The method of encapsulating the display element according to claim 10, wherein the display element is used in a plastic light emitting diode (PLED).

23. The method of encapsulating the display element according to claim 10, wherein the luminescent body is at least laminated with an anode layer, an organic luminescent layer and a cathode layer.