Thermal-sprayed metallic conformal coatings used as heat spreaders
First Claim
1. A method of dissipating heat from an electronic device having an enclosure and at least one heat-generating source received within the enclosure, the enclosure having one or more parts, and at least one of the parts having an exterior surface and an opposing interior surface, the method comprising the steps of:
- (a) covering at least a portion of the interior surface of said one of the enclosure parts with a conformal metallic layer; and
(b) disposing the conformal metallic layer covered on said one of the enclosure parts and the source in beat transfer adjacency with each other.
7 Assignments
0 Petitions
Accused Products
Abstract
Heat dissipation and electromagnetic interference (EMI) shielding for an electronic device having an enclosure. An interior surface of the enclosure is covered with a conformal metallic layer which, as disposed in thermal adjacency with one or more heat-generating electronic components or other sources contained within the enclosure, may provide both thermal dissipation and EMI shielding for the device. The layer may be sprayed onto the interior surface in a molten state and solidified to form a self-adherent coating.
-
Citations
30 Claims
-
1. A method of dissipating heat from an electronic device having an enclosure and at least one heat-generating source received within the enclosure, the enclosure having one or more parts, and at least one of the parts having an exterior surface and an opposing interior surface, the method comprising the steps of:
-
(a) covering at least a portion of the interior surface of said one of the enclosure parts with a conformal metallic layer; and
(b) disposing the conformal metallic layer covered on said one of the enclosure parts and the source in beat transfer adjacency with each other. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
-
2. The method of claim 2 wherein the metallic layer comprises tin, nickel, copper, zinc, aluminum, silver, or an alloy thereof.
- 17. A thermal management assembly for an electronic device having an enclosure and at least one heat-generating source received within the enclosure, the enclosure having one or more parts, and at least one of the parts having an exterior surface and an opposing interior surface, the assembly comprising a conformal metallic layer covering at least a portion of the interior surface of said one of the enclosure parts, and being disposed in heat transfer adjacency with the source received within the enclosure.
Specification