Apparatus for processing a substrate including a heating apparatus

• US 20030066826A1
• Filed: 10/04/2002
• Published: 04/10/2003
• Est. Priority Date: 10/05/2001
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Tae-Won, Bae, Do-In, Lee, Sang-Yeoul
• Granted Patent: US 6,787,739 B2
• Time in Patent Office: Days
• US Class Current: 219/444.1
• CPC Class Codes: H01L 21/67103 mainly by conduction
• CPC Class Codes: H05B 3/72 Plates of sheet metal

Abstract

An apparatus for heating a substrate of a semiconductor device includes a hot plate, on which a semiconductor substrate is placed, and a heater for heating the hot plate. The hot plate is preferably a composite plate including a plurality of plates having different thermal conductivities from each other. For example, a first plate adjacent to the heater can be made of aluminum, which has a relatively high thermal conductivity. A second plate, laminated on top of the first plate, can be made of titanium or stainless steel, which both have a thermal conductivity lower than aluminum. A composite hot plate as disclosed herein is better able to maintain a constant temperature and a uniform temperature distribution in order to more uniformly heat a substrate and to reduce an amount of energy required for the heating process. In addition, the reliability and productivity of the semiconductor device manufactured by the apparatus can be improved.

Claims

1. An apparatus for heating a substrate comprising:

a heater for generating heat to heat the substrate; and

a hot plate for supporting the substrate, said hot plate comprising a plurality of plates,

wherein each of the plates has a different thermal conductivity from at least one of the other plates, wherein the substrate is heated by transferring heat from the heater to the substrate through the hot plate.

2. The apparatus according to claim 1, wherein the hot plate comprises at least two plates formed from two separate materials selected from the group consisting of copper, aluminum, stainless steel, and titanium.

3. The apparatus according to claim 1, wherein the hot plate comprises:

a first plate comprising a material having a first thermal conductivity; and

a second plate comprising a material having a second thermal conductivity lower than

the first thermal conductivity, wherein the second plate is arranged on an upper surface of the first plate to support the substrate.

4. The apparatus according to claim 3, wherein the first plate comprises aluminum and wherein the second plate comprises stainless steel or titanium.

5. The apparatus according to claim 1, wherein the hot plate comprises:

a first plate made from a material having a first thermal conductivity;

a second plate made from a material having a second thermal conductivity, said second plate being disposed on an upper surface of the first plate; and

a third plate made from a material having a third thermal conductivity, said third plate being arranged on an lower surface of the first plate.

6. The apparatus according to claim 5, wherein the second thermal conductivity is lower than the first thermal conductivity and wherein the third thermal conductivity is approximately equal to the second thermal conductivity.

7. The apparatus according to claim 6, wherein the first plate is made of aluminum and wherein the second and third plates are made of stainless steel or titanium.

8. The apparatus according to claim 1, wherein the hot plate comprises:

a first plate having a first thermal conductivity;

a second plate disposed on an upper surface of the first plate, said second plate having a second thermal conductivity that is lower than the first thermal conductivity; and

a third plate arranged on an upper surface of the second plate, said third plate having a third thermal conductivity that is lower than the second thermal conductivity.

9. The apparatus according to claim 8, wherein the first plate comprises copper, the second plate comprises aluminum, and the third plate comprises stainless steel or titanium.

10. The apparatus according to claim 1, wherein the heater includes a hot wire for generating heat using electric power.

11. The apparatus according to claim 10, wherein the hot plate is arranged on an upper surface of the heater and is heated by heat conducted from the heater.

12. The apparatus according to claim 1, wherein the heater includes a lamp.

13. The apparatus according to claim 12, wherein the hot plate is arranged over the heater and is heated by light radiated from the lamp.

14. The apparatus according to claim 1, further comprising:

a sensor installed on an edge portion of an upper surface of the hot plate to sense a temperature of the hot plate; and

a controller, connected to the sensor, for controlling the temperature of the hot plate using a temperature signal from the sensor.

15. The apparatus according to claim 14, wherein the sensor comprises a plurality of sensors installed along a peripheral portion of the hot plate.

17. The apparatus according to claim 15, wherein the chamber performs a process to remove a photoresist layer formed on the substrate using a plasma.

18. The apparatus according to claim 15, wherein the chamber performs a process to form a layer on the substrate using a plasma.

16. An apparatus for manufacturing a substrate comprising:

a chamber for performing a manufacturing process on the substrate;

a gas supplying part to provide a gas to the chamber; and

means for heating the substrate, said means for heating comprising a heater and a hot plate, wherein said hot plate comprises a plurality of plates having two or more different thermal conductivities.

19. An apparatus for manufacturing a substrate comprising:

a chamber for performing a substrate manufacturing process;

a heater arranged in the chamber to heat the substrate; and

a composite hot plate comprising a plurality of plates, wherein each of the plates has a thermal conductivity that is different from at least one of the other plates, wherein the substrate is heated using heat provided from the heater through the composite hot plate.

20. The apparatus according to claim 19, wherein the substrate manufacturing process comprises baking a photoresist layer coated on the substrate.