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Integrated field flattener for sensors

  • US 20030066955A1
  • Filed: 10/09/2001
  • Published: 04/10/2003
  • Est. Priority Date: 10/09/2001
  • Status: Abandoned Application
First Claim
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1. In combination, a package containing a sensor die and an optically transparent window for permitting electromagnetic radiation to be sensed by said sensor die and for providing an hermetic seal to said package to protect said sensor die against damage and contamination, wherein said optically transparent window includes an optically transparent thermoset plastic lens.

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