Semiconductor package
First Claim
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1. A semiconductor package comprising:
- a chip having an active surface and an outside surface, the chip having a plurality of electrode bumps formed on the active surface thereof;
a package substrate having an upper surface and a lower surface opposite the upper surface, the chip being electrically connected to the upper surface of the substrate;
a lid thermally connected to and disposed over the upper surface of the chip for emitting heat generated from the chip;
a thermal interface material (TIM) interposed between the chip and the lid for transferring heat generated from the chip to the lid; and
a heat dissipation means also interposed between the chip and the lid for dissipating heat, the heat dissipation means adjacent the TIM.
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Abstract
Semiconductor packages are provided to prevent a chip, such as a central processing unit (CPU) chip, from being degraded due to hot spot heat generated during the operation of the chip and absorbs thermomechanical stresses in interfaces between the chip, a thermal interface material (TIM) and a lid. The chip is electrically connected, e.g., flip-chip bonded, to a package substrate. The lid is thermally connected to and disposed over a back surface of the chip with the TIM interposed therebetween. A heat dissipation means adjacent the TIM is also located between the lid and the chip to prevent the hot spot effect.
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Citations
15 Claims
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1. A semiconductor package comprising:
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a chip having an active surface and an outside surface, the chip having a plurality of electrode bumps formed on the active surface thereof;
a package substrate having an upper surface and a lower surface opposite the upper surface, the chip being electrically connected to the upper surface of the substrate;
a lid thermally connected to and disposed over the upper surface of the chip for emitting heat generated from the chip;
a thermal interface material (TIM) interposed between the chip and the lid for transferring heat generated from the chip to the lid; and
a heat dissipation means also interposed between the chip and the lid for dissipating heat, the heat dissipation means adjacent the TIM. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification