Testing arrangement and testing method

• US 20030067314A1
• Filed: 10/18/2002
• Published: 04/10/2003
• Est. Priority Date: 02/11/2000
• Status: Abandoned Application

• Current Assignee: Elektrobit Testing OY
• Original Assignee: Elektrobit Testing OY
• Inventors: Kaukko, Pekka
• Application Number:
  US10/203,183
• Publication Number:
  US 20030067314A1
• Time in Patent Office: Days
• US Class Current: 324/754
• CPC Class Codes: G01R 31/2853 Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections G01R31/31717 takes precedence; test of chip-to-PCB or lead-to-PCB connections G01R31/66
• CPC Class Codes: G01R 31/318555 Control logic

Abstract

The invention relates to a testing arrangement which comprises a connection (2) to be tested comprising one or more analogue components (11, 12). According to the invention, to test one or more analogue components of the connection (2) the testing arrangement comprises a Boundary Scan-type digital component (21) which comprises one or more contact elements (31 to 33), and through one or more contact elements, the Boundary Scan digital component (21) is connected to the connection (2) being tested so that by means of an internal digital Boundary Scan control line (41) of the Boundary Scan digital component (21) and controlled by a controller (51) in the testing arrangement, a voltage-level control according to a digital logic value can be provided in at least one location to the connection (2) being tested comprising one or more analogue components. The arrangement also comprises a measuring instrument (60) which measures the connection (2) being tested comprising one or more analogue components and the Boundary Scan-type digital component connected to it, for the purpose of measuring the impact of the voltage-level control directed to the connection being tested. The arrangement further comprises a means (70) for analysing the measurement information of the measuring instrument (60), which determines a testing result concerning one or more analogue components of the connection on the basis of the measurement information of the measuring instrument (60).

Claims

1. A testing arrangement which comprises

a connection (2) to be tested comprising one or more analogue components (11, 12),

characterized in that for testing one or more analogue components of the connection (2) the testing arrangement comprises

a Boundary Scan-type digital component (21) which comprises one or more contact elements (31 to 33), and through one or more contact elements the Boundary Scan digital component (21) is connected to the connection (2) being tested so that by means of an internal digital Boundary Scan control line (41) of the Boundary Scan digital component (21) and controlled by a controller (51) in the testing arrangement, a voltage-level control according to a digital logic value can be provided to the connection (2) being tested comprising one or more analogue components in at least one location,

a measuring instrument (60) which measures the connection (2) being tested comprising one or more analogue components and the Boundary Scan-type digital component connected to the connection for the purpose of measuring the impact of the voltage-level control directed to the connection being tested, and

a means (70) for analysing the measurement information of the measuring instrument (60), which determines a testing result concerning one or more analogue components of the connection on the basis of the measurement information of the measuring instrument (60).

2. A testing arrangement as claimed in claim 1, characterized in that the controller (51) in the testing arrangement and performing the voltage-level control is an external controller outside the Boundary Scan-type digital component.

3. A testing arrangement as claimed in claim 2, characterized in that the Boundary Scan-type digital component comprises an internal controller (110) to which the internal digital Boundary Scan control line is (41) is connected, and that the internal controller (110) is connected to the external controller (51).

4. A testing arrangement as claimed in claim 1, characterized in that the controller (51) of the testing arrangement, which performs the voltage-level control, is an internal controller of the Boundary Scan-type digital component.

5. A testing arrangement as claimed in claim 1, characterized in that the internal digital Boundary Scan control line (41) of the Boundary Scan-type digital component is arranged to provide for the connection being tested a voltage-level control of a first type, during which the measuring instrument is arranged to measure a first measurement value, and that the control line is arranged to provide a voltage-level control of a second type differing from the first voltage-level control, during which second-type voltage-level control the measuring instrument is arranged to measure a second measurement value, and that the means (70) analysing the measurement information of the measuring instrument is arranged to define a testing result concerning one or more analogue components on the basis of the change between the measurement values.

6. A testing arrangement as claimed in claim 5, characterized in that the measurement value is a value of current.

7. A testing arrangement as claimed in claim 5, characterized in that the change between the measurement values is the difference in the values.

8. A testing arrangement as claimed in claim 1, characterized in that the Boundary Scan-type digital component and the connection being tested comprising one or more analogue components belong to the same functional connection entity.

9. A testing arrangement as claimed in claim 1 or 2, characterized in that the Boundary Scan digital component is on the same connection base with the connection being tested.

10. A testing arrangement as claimed in claim 1 or 2, characterized in that the Boundary Scan digital component and the connection being tested are on different connection bases.

11. A testing arrangement as claimed in claim 1, 2 or 10, characterized in that the Boundary Scan digital component is connected to the connection being tested through a coupler (600).

12. A testing arrangement as claimed in claim 1, characterized in that the coupler is a connector structure.

13. A testing arrangement as claimed in claim 1, characterized in that the Boundary Scan digital component is an integrated circuit.

14. A testing arrangement as claimed in claim 1, characterized in that at least one analogue component of the connection being tested is a passive component.

15. A testing arrangement as claimed in claim 1 or 14, characterized in that at least one analogue component of the connection being tested is a component comprising one or more semiconductor barrier layers.

16. A testing arrangement as claimed in claim 1, 14 or 15, characterized in that at least one analogue component of the connection being tested is a diode or transistor.

17. A testing arrangement as claimed in claim 1, characterized in that at least one analogue component of the connection being tested is a resistor, coil or capacitance.

18. A testing arrangement as claimed in claim 1, characterized in that the Boundary Scan, digital component is connected to the connection being tested through at least two contact elements (31, 33) so that by means of the internal digital Boundary Scan control line of the Boundary Scan digital component and controlled by the controller in the testing arrangement, a voltage-level control according to a digital logic value can be provided to the connection being tested comprising one or more analogue components in at least two locations.

19. A testing arrangement as claimed in claim 1, characterized in that the measuring instrument is a current meter.

20. A testing arrangement as claimed in claim 1, characterized in that with one voltage-level control, the measuring instrument receives for measurement a signal running through the Boundary Scan digital component.

21. A testing arrangement as claimed in claim 1, characterized in that with a second voltage-level control, the measuring instrument receives for measurement a signal running through the Boundary Scan digital component and one or more analogue components.

22. A testing method for testing a connection comprising one or more analogue components,

characterized by

using a Boundary Scan-type digital component (21) which comprises one or more contact elements (31 to 33), through which one or more contact elements, the Boundary Scan digital component (21) is connected to the connection (2) being tested,

providing by means of an internal digital Boundary Scan control line (41) of the Boundary Scan digital component (21) a voltage-level control according to a digital logic value to the connection (2) being tested comprising one or more analogue components in at least one location through at least one contact element,

measuring the connection (2) being tested comprising one or more analogue components and the Boundary Scan-type digital component (21) connected to the connection for the purpose of measuring the impact of the voltage-level control directed to the connection being tested, and

analysing the measurement information and determining one or more testing results concerning one or more analogue components of the connection on the basis of the measurement information.

23. A testing method as claimed in claim 22,

characterized in that

by means of the internal digital Boundary Scan control line of the Boundary Scan-type digital component, the connection being tested is provided a voltage-level control of a first type, during which a first measurement value is measured,

a voltage-level control of a second type differing from the voltage-level control of the first type is provided, during which a second measurement value is measured,

the obtained measurement information is analysed and one or more testing results concerning one or more analogue components are defined on the basis of the change between the measurement values.

24. A testing method as claimed in claim 22 or 23, characterized in that the measurement is performed by measuring current.

25. A testing method as claimed in claim 23, characterized in that one or more testing results concerning one or more analogue components are defined on the basis of the difference between the measurement values.

26. A testing method as claimed in claim 22, 23 or 24, characterized by providing a voltage-level control in at least two locations to the connection being tested comprising one or more analogue components.