Liquid crystal display device and method of making the same

• US 20030067576A1
• Filed: 05/30/2002
• Published: 04/10/2003
• Est. Priority Date: 10/10/2001
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Philips LCD Company Limited (LG Display Co., Ltd.)
• Inventors: Cho, Hyoung Soo
• Granted Patent: US 6,760,090 B2
• Time in Patent Office: Days
• US Class Current: 349/149
• CPC Class Codes: G02F 1/1333 Constructional arrangements; Manufacturing methodsG02F1/135, G02F1/136 take precedence
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H05K 2201/09154 Bevelled, chamferred or tapered edge
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits

Abstract

A liquid crystal display includes a liquid crystal panel having a plurality of pads, a printed circuit board, a tape carrier package electrically interconnecting the liquid crystal panel and the printed circuit board, an electrode lead portion formed on a rear surface of the tape carrier package, an anisotropic conductive film connected to at least one of the plurality of pads of the liquid crystal panel and formed at a first side of the electrode lead portion, and a solder resist formed at a second side of the electrode lead portion and contacting the anisotropic conductive film.

Claims

1. A liquid crystal display, comprising:

a liquid crystal panel having a plurality of pads;

a printed circuit board;

a tape carrier package electrically interconnecting the liquid crystal panel and the printed circuit board;

an electrode lead portion formed on a rear surface of the tape carrier package;

an anisotropic conductive film connected to at least one of the plurality of pads of the liquid crystal panel and formed at a first side of the electrode lead portion; and

a solder resist formed at a second side of the electrode lead portion and contacting the anisotropic conductive film.

2. The liquid crystal display according to claim 1, wherein the liquid crystal panel includes an upper substrate and a lower substrate facing the upper substrate.

3. The liquid crystal display according to claim 2, wherein at least one edge of the lower substrate has an inclined surface formed by a grinding process.

4. The liquid crystal display according to claim 3, wherein the anisotropic conductive film extends about 0.1-0.2 mm from a point where the inclined surface of the lower substrate contacts the anisotropic conductive film along a direction of the printed circuit board.

5. The liquid crystal display according to claim 3, wherein the solder resist extends about 0.1-0.2 mm from an end of the lower substrate along a direction of the liquid crystal panel.

6. The liquid crystal display according to claim 1, further includes a driving circuit for supplying a driving signal to the liquid crystal panel.

7. The liquid crystal display according to claim 6, wherein the direct circuit is disposed between the printed circuit board and the tape carrier package.

8. The liquid crystal display according to claim 1, wherein upper surfaces of the printed circuit board, the plurality of pads, and the solder resist are within a same plane.

9. The liquid crystal display according to claim 1, wherein the electrode lead portion contacts a first surface of the printed circuit board and the solder resist contacts a second surface of the printed circuit board adjacent to the first surface.

10. The liquid crystal display according to claim 1, wherein the solder resist includes a first end portion contacting a side region of at least one of the plurality of pads and a second end portion contacting a side region of the printed circuit board.

11. A method for fabricating a liquid crystal display, comprising:

interconnecting a liquid crystal panel and a printed circuit board via a tape carrier package;

forming an anisotropic conductive film on at least one of a plurality of pads of the liquid crystal panel and at a first side of an electrode lead portion formed on a rear surface of the tape carrier package; and

forming a solder resist at a second side of the electrode lead portion to contact the anisotropic conductive film.

12. The method according to claim 11, wherein the liquid crystal panel includes an upper substrate and a lower substrate facing the upper substrate.

13. The method according to claim 12, wherein at least one edge of the lower substrate has an inclined surface formed by a grinding process.

14. The method according to claim 13, wherein the anisotropic conductive film extends about 0.1-0.2 mm from a point where the inclined surface of the lower substrate contacts the anisotropic conductive film along a direction of the printed circuit board.

15. The method according to claim 13, wherein the solder resist extends about 0.1-0.2 mm from an end of the lower substrate along a direction of the liquid crystal panel.

16. The method according to claim 11, further including a step of providing a driving circuit for supplying a driving signal to the liquid crystal panel.

17. The method according to claim 16, wherein the direct circuit is provided between the printed circuit board and the tape carrier package.

18. The method according to claim 11, wherein upper surfaces of the printed circuit board, the plurality of pads, and the solder resist are within a same plane.

19. The method according to claim 11, wherein the electrode lead portion contacts a first surface of the printed circuit board and the solder resist contacts a second surface of the printed circuit board adjacent to the first surface.

20. The method according to claim 11, wherein the solder resist includes a first end portion contacting a side region of at least one of the plurality of pads and a second end portion contacting a side region of the printed circuit board.