Water cooled inverter

• US 20030067749A1
• Filed: 07/16/2002
• Published: 04/10/2003
• Est. Priority Date: 10/09/2001
• Status: Active Grant

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Momma, Naohiro, Saito, Ryuichi, Nakamura, Takayoshi, Tamba, Akihiro
• Granted Patent: US 6,621,701 B2
• Time in Patent Office: Days
• US Class Current: 361/699
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/1627 stacked type assemblies, e.g. stacked multi-cavities
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

According to the invention, there is provided a water cooled inverter structure forming a plurality of shallow cavities and deep cavities in a housing, fixing a bottom surface of power semiconductor modules to shallow cavities to form a shallow water channel and directly cooling the power semiconductor modules using this shallow water channel. Since cooling water flows fast in the shallow water channel, it is possible to improve a cooling efficiency and also reduce pressure loss using a deep water channel with deep cavities. Furthermore, providing a plurality of cavities makes it possible to reduce a size of the power semiconductor modules and provide a plurality of power semiconductor modules, thus improving reliability. It is possible to place a control board below the water channel to thermally cut off the control board from the power semiconductor modules, which makes it possible to reduce temperature of a control circuit.

Claims

1. A water cooled inverter comprising:

an IGBT module portion comprising a plurality of IGBT modules, a metallic plate bonded to the IGBT module, a first water channel formed by the metallic plate, and a second water channel formed between the IGBT modules, the first water channel having a first depth, the second water channel having a second depth deeper than the first depth;

a control circuit board for driving the IGBT module, which control circuit board is formed on one plane side of the IGBT module portion;

a first connecting portion electrically connecting the control circuit board with the IGBT module portion;

a microcomputer board formed on the opposite plane side of the IGBT module portion with respect to the control circuit board;

a second connecting portion electrically connecting the microcomputer board with the control circuit board; and

a container accommodating the IGBT module portion, the control circuit board, the microcomputer board, the first connecting portion, and the second connecting portion;

wherein

cooling water for cooling the IGBT module portion and the microcomputer board flows in the first water channel and the second water channel.

2. The water cooled inverter according to claim 1, wherein

a supply and drain opening for supplying and draining the cooling water is provided at least in the second water channel, and

the first depth is defined by at least one of the depth of a cavity provided in a part of the container accommodating the IGBT module portion and the depth of a cavity provided in a bottom surface of the metallic plate.

3. The water cooled inverter according to claim 1, wherein

the first water channel and the second water channel have at least two areas of different depths,

the shallowest water channel area is defined by a bottom surface of the IGBT module portion and a part of the container, and

the depth of the water channel area is determined by the depth of a cavity formed in the part of the container.

4. The water cooled inverter according to claim 3, wherein

the depth of the shallowest water channel area for cooling the IGBT module portion is 5 mm or less.

5. The water cooled inverter according to claim 2, wherein

a control circuit board for controlling said power circuit device is placed above the power circuit device having said power semiconductor chip, and

a part of a circuit device mounted on the control circuit board is connected to the container via a heat conductive resin sheet.

6. A water cooled inverter comprising:

a supply and drain opening for supplying and draining cooling water;

a water channel connected to the supply and drain opening, which water channel allows the cooling water to flow therein;

a power circuit device on which a power semiconductor chip is mounted, which power circuit device is provided with a metallic body on its bottom surface;

a control circuit board for controlling the power circuit device; and

a microcomputer board for controlling the control circuit board;

wherein

a water channel area for cooling the power circuit device is defined by a bottom surface of the metallic body and a part of a housing of the power circuit device,

the cooling water is adapted to be directly applied to the metallic body, and

the control circuit board for controlling the power circuit device and the microcomputer board are disposed on an upper side and on a lower side of the power circuit device on the water channel area for cooling the power circuit device, respectively.

7. The water cooled inverter according to claim 6, wherein

the water channel has at least two areas of different depths,

the shallowest water channel area is defined by a bottom surface of the power circuit device on which the power semiconductor chip is mounted and the housing of the power circuit device, and

the depth of the water channel area is determined by the depth of a cavity formed in a part of the housing.

8. A water cooled inverter comprising:

a supply and drain opening for supplying and draining cooling water;

a water channel connected to the supply and drain opening, which water channel allows the cooling water to flow therein;

a power circuit device on which a power semiconductor chip is mounted, which power circuit device is provided with a metallic body on its bottom surface;

at least two control circuit boards for controlling the power circuit device; and

a top cover and a bottom cover for covering the top and the bottom of an apparatus, respectively;

wherein

a housing of the power circuit device comprises a container defining a water channel connected to the bottom surface of the power circuit device so that the cooling water is directly applied to the bottom surface of the power circuit device, and a side wall surrounding the power circuit device, and

at least one of the control circuit boards is accommodated in the bottom and radiates heat from the water channel.