Opto-electronic package for integrated sealing of optical fibers
First Claim
1. An opto-electronic package comprising the combination of:
- an enclosed package;
a plurality of electrical contacts extending into the enclosed package;
an optical integrated circuit mounted within the package and coupled to the electrical contacts; and
an optical fiber extending through at least one peripheral portion of the package to the optical integrated circuit along a common plane;
wherein the package is comprised of opposite portions joined together at an interface substantially at the common plane.
2 Assignments
0 Petitions
Accused Products
Abstract
An opto-electronic package includes an enclosed package, a plurality of the electrical contacts extending into the enclosed package, an optical integrated circuit mounted within the package and coupled to the electrical contacts, and optical fibers extending through opposite ends of the package to the optical integrated circuit along a common plane. The package is comprised of a package body and an opposite package lid joined together at an interface substantially at the common plane, and configured to form end pipes around the optical fibers at the opposite ends of the package. This enables the optical fibers to be laid into feedthroughs formed by opposing portions of the package body and the package lid before they are joined together, eliminating the need to feed the fibers through opposite apertures in the package body and for a separate subassembly to mount the opposite fibers and the integrated circuit. The package body and the package lid are solder sealed to each other, and the optical fibers are solder sealed with the end pipes at the opposite ends of the package, to form a hermetically sealed package.
9 Citations
17 Claims
-
1. An opto-electronic package comprising the combination of:
-
an enclosed package;
a plurality of electrical contacts extending into the enclosed package;
an optical integrated circuit mounted within the package and coupled to the electrical contacts; and
an optical fiber extending through at least one peripheral portion of the package to the optical integrated circuit along a common plane;
wherein the package is comprised of opposite portions joined together at an interface substantially at the common plane. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. An opto-electronic package comprising the combination of:
-
a package body having electrical leads extending through at least one side thereof to wire bond pads within the body, and a fiber feedthrough path extending through the package body from opposite ends thereof;
an optical integrated circuit mounted in the package body in the fiber feedthrough paths;
a pair of fiber arrays extending into the package body from the opposite ends thereof along the fiber feedthrough path to opposite sides of the optical integrated circuit; and
a package lid mounted on and enclosing the package body and having opposite feedthrough portions disposed at the fiber feedthrough path. - View Dependent Claims (10, 11, 12, 13, 14)
-
-
15. A method of making an opto-electronic package comprising the steps of:
-
providing a package body having fiber feedthrough paths on opposite sides of an optical integrated circuit;
laying optical fibers in the fiber feedthrough paths on the opposite sides of the optical integrated circuit, aligning the optical fibers and attaching the optical fibers to the optical integrated circuit;
providing a package lid having fiber feedthrough paths at opposite ends thereof;
mounting the package lid on the package body so that the fiber feedthrough paths thereof are disposed on opposite sides of the optical fibers from the fiber feedthrough paths of the package body;
sealing the package lid to the package body; and
sealing the optical fibers with the fiber feedthrough paths of the package body and the package lid. - View Dependent Claims (16, 17)
-
Specification