Multiaxial inertial sensor system and method of producing same
First Claim
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1. A multiaxial inertial sensor system, comprising:
- a plurality of rigid circuit substrates;
connecting structures including one of flexible and rigid structures electrically and mechanically interconnecting the plurality of rigid circuit substrates; and
a plurality of sensor chips mounted on the plurality of rigid circuit substrates at a wafer level, the plurality of sensor chips electrically contacting the plurality of rigid circuit substrates;
wherein each of the plurality of sensor chips is assigned to a respective sensor axis.
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Abstract
A multiaxial inertial sensor system, for example, a rotational rate and acceleration sensor system for driving dynamics regulation in motor vehicles, in which a plurality of sensor chips are assigned to respective sensor axes and are mounted on a plurality of rigid circuit substrates at a wafer level. The circuit substrates may be oriented according to a respective sensor axis and are electrically contacted to the substrate, and the circuit substrates are electrically and mechanically interconnected by flexible or rigid connecting structures.
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Citations
20 Claims
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1. A multiaxial inertial sensor system, comprising:
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a plurality of rigid circuit substrates;
connecting structures including one of flexible and rigid structures electrically and mechanically interconnecting the plurality of rigid circuit substrates; and
a plurality of sensor chips mounted on the plurality of rigid circuit substrates at a wafer level, the plurality of sensor chips electrically contacting the plurality of rigid circuit substrates;
wherein each of the plurality of sensor chips is assigned to a respective sensor axis. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of producing a multiaxial inertial sensor system, the method comprising:
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producing a carrier and connection structure composed of a plurality of rigid circuit substrates, each of the plurality of rigid circuit substrates assigned to a respective sensor axis, the plurality of rigid circuit substrates including;
electric contact and printed conductor elements, connecting structures including one of flexible and rigid connecting structures connecting the plurality of rigid circuit substrates to one another, and printed conductor elements;
providing sensor chips for a plurality of sensor axes at a wafer level; and
mechanically and electrically connecting the sensor chips to the electric contact elements of the plurality of rigid circuit substrates. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification