Induction plasma reactor

• US 20030071035A1
• Filed: 10/11/2002
• Published: 04/17/2003
• Est. Priority Date: 10/16/2001
• Status: Active Grant

• Current Assignee: Adam Alexander Brailove
• Original Assignee: Adam Alexander Brailove
• Inventors: Brailove, Adam Alexander
• Granted Patent: US 6,855,906 B2
• Time in Patent Office: Days
• US Class Current: 219/672
• CPC Class Codes: H05B 6/108 for heating a fluid
• CPC Class Codes: H05H 1/46 using applied electromagnetic fields, e.g. high frequency or microwave energy H05H1/26 takes precedence
• CPC Class Codes: H05H 1/4652 using inductive coupling means, e.g. coils

Abstract

The invention is a plasma-generating device useful in a wide variety of industrial processes. The plasma is formed in a chamber having a toroidal topology, and is heated inductively. As with all inductive plasmas, a primary coil carries an applied AC current, which, in turn, generates a corresponding applied AC magnetic flux inside the plasma. This flux induces current to flow through the plasma in closed paths that encircle the flux, thereby heating and maintaining the plasma. In this invention, the applied AC current flows through the primary coil around substantially the short poloidal direction on the torus. Accordingly, the applied magnetic flux is caused to circulate through the plasma along the larger toroidal direction. Finally, the current induced within the plasma will flow in the poloidal direction, anti-parallel to the applied primary current. The plasma chamber wall is preferably made of metal such as aluminum and includes one or more electrical breaks that extend fully around the chamber wall in the toroidal direction. This prevents poloidal currents from being induced in the chamber wall, ensuring effective power transfer to the plasma. Elastomeric seals made from electrically insulating material seal the breaks.

Claims

1. An apparatus for inductively generating a plasma from process gasses comprising:

a. a chamber adapted for receiving said process gasses and for containing said plasma,

b. a chamber wall having an inner surface defining said chamber, the shape of said inner surface of said chamber wall having a generally toroidal topology, said toroidal topology defining a torus with a hole, a cyclic toroidal direction encircling said hole, and a cyclic poloidal direction generally orthogonal to said toroidal direction,

c. a plasma excitation means comprising an electrically conductive material adapted for carrying electrical current in a generally poloidal direction around said plasma,

d. an AC power source operatively coupled to said plasma excitation means, whereby an applied AC electrical current is urged to flow through said plasma excitation means,

whereby said applied AC electrical current, flowing generally parallel to said poloidal direction, generates an AC magnetic flux directed generally parallel to said toroidal direction within said plasma, said AC magnetic flux thereby further causing an induced electrical current to flow through said plasma in a generally poloidal direction, thereby ionizing said processing gasses and inductively heating and maintaining said plasma.

2. The apparatus of claim 1 wherein said chamber wall comprises:

a. at least one metallic portion,

b. at least one electrically insulative portion, encircling the chamber completely in said toroidal direction, providing an electrical break in said poloidal direction, thereby preventing induced electrical currents from circulating continuously through said chamber wall in said poloidal direction,

whereby the AC electrical power from said AC power source is efficiently coupled into said plasma.

3. The apparatus of claim 2 wherein said plasma excitation means comprises said at least one metallic portion of said chamber wall, said applied AC electrical current flowing generally along said poloidal direction through portions of said chamber wall, whereby said chamber wall serves additionally to carry said applied AC electrical current.

4. The apparatus of claim 2 wherein said plasma excitation means surrounds said chamber wall and is generally insulated therefrom, said plasma excitation means being electrically coupled to said chamber wall at no more than one point, whereby said applied AC electrical current does not flow through said chamber wall.

5. The apparatus of claim 1 wherein said plasma excitation means comprises a coil, said coil comprising a plurality of turns wound around said chamber and passing through said hole in said torus.

6. The apparatus of claim 1 wherein said chamber wall substantially consists of a dielectric material.

7. The apparatus of claim 1 wherein the toroidal inner surface of said chamber is further generally a surface of rotation, said surface of rotation being defined by sweeping a closed two-dimensional curve about an axis co-planar and non-intersecting with said closed two-dimensional curve.

8. The apparatus of claim 1 further comprising a plurality of permanent magnets disposed across said chamber wall and generally surrounding said chamber volume, wherein each said permanent magnet is magnetically polarized in a direction substantially anti-parallel to the polarization of adjacent permanent magnets, said permanent magnets producing a multi-cusp magnetic field surrounding and confining said plasma, whereby said plasma is more easily started and the plasma density of said plasma is higher.

9. The apparatus of claim 1 wherein said apparatus further comprises at least one inlet opening disposed in said chamber wall and at least one outlet opening disposed in said chamber wall whereby process gasses may be controllably flowed through said chamber.

10. The apparatus of claim 2 wherein said inner surface of said chamber wall is coated with a coating material resistant to erosion by said plasma.

11. The apparatus of claim 10 wherein said coating material comprises a ceramic.

12. The apparatus of claim 10 wherein said at least one metallic portion of said chamber wall is aluminum and said coating is formed by anodization.

13. The apparatus of claim 10 wherein said coating material comprises a fluoropolymer.

14. The apparatus of claim 9 wherein said chamber is further coupled to a workpiece processing chamber, said at least one outlet opening providing fluid communication of reactive chemical species generated by said plasma into said workpiece processing chamber, whereby the inner walls of said workpiece processing chamber are cleaned by said reactive chemical species.

15. The apparatus of claim 9 wherein said chamber is further coupled to a workpiece processing chamber containing a workpiece, said at least one outlet opening providing fluid communication of reactive chemical species generated by said plasma into said workpiece processing chamber whereby said workpiece undergoes a processing step selected from the group of etching, deposition, ashing, and atomic layer deposition.

16. The apparatus of claim 9 wherein said chamber is further provided with a workpiece opening adapted to receive a workpiece into said chamber, whereby said workpiece is undergoes a processing step selected from the group of etching, deposition, ashing, and atomic layer deposition.

17. The apparatus of claim 9 further comprising an extraction electrode positioned near said at least one outlet opening, said extraction electrode having an electrical potential different from said chamber wall, whereby ions are pulled out of said at least one outlet opening and accelerated, thereby forming an ion beam.

18. The apparatus of claim 9 wherein said at least one inlet opening accepts process gasses comprising waste gasses into said chamber, said plasma promoting chemical reactions amongst said process gasses, thereby transforming said waste gasses into more benign chemical species that are exhausted through said at least one outlet opening, whereby said waste gasses are treated.

19. The apparatus of claim 1 wherein said process gasses comprise elements selected from the group consisting of hydrogen, oxygen, chlorine, fluorine, nitrogen, helium, neon, argon, krypton, and xenon.

20. The apparatus of claim 2 wherein the electrically insulative portions are mounted in narrow convoluted recesses between the metallic portions, whereby the electrically insulative portions are protected from said plasma.

21. The apparatus of claim 1 wherein said AC power source comprises:

a. an AC power supply,

b. an impedance matching circuit, operatively interposed between said AC power supply and said plasma excitation means,

whereby power is efficiently transmitted from said an AC power supply into said plasma.

22. The apparatus of claim 1 wherein said AC power source comprises a solid-state AC switching power supply, said solid state AC switching power supply comprising one or more switching semiconductor devices coupled to a voltage supply and having an output coupled directly to said plasma excitation means.

23. The apparatus of claim 1 wherein said AC power source comprises:

a. a solid-state AC switching power supply, said solid state AC switching power supply comprising one or more switching semiconductor devices coupled to a voltage supply and having an output,

b. a capacitance disposed between said output of said switching semiconductor devices of said AC switching power supply and said plasma excitation means, and electrically coupled thereto, said capacitance and the impedance appearing across said plasma excitation means together forming a resonant circuit having a resonant frequency,

wherein said AC switching power supply switches at a frequency substantially equal to said resonant frequency, whereby power is efficiently transmitted from said an AC power supply into said plasma.

24. The apparatus of claim 1 wherein said AC power source comprises:

a. a solid-state AC switching power supply, said solid state AC switching power supply comprising one or more switching semiconductor devices coupled to a voltage supply and having an output,

b. an impedance matching transformer having a primary winding coupled to said output of said switching semiconductor devices of said AC switching power supply and a secondary winding coupled to said plasma excitation means,

whereby power is efficiently transmitted from said an AC switching power supply into said plasma.

25. The apparatus of claim 1 wherein said AC power source comprises:

a. a solid-state AC switching power supply, said solid state AC switching power supply comprising one or more switching semiconductor devices coupled to a voltage supply and having an output,

b. an impedance matching transformer having a primary winding coupled to said output of said switching semiconductor devices of said AC switching power supply and having a secondary winding,

c. a capacitance disposed between said secondary winding of said impedance matching transformer and said plasma excitation means, and electrically coupled therebetween, said capacitance and the impedance appearing across said plasma excitation means together forming a resonant circuit having a resonant frequency,

wherein said AC switching power supply switches at a frequency substantially equal to said resonant frequency, whereby power is efficiently transmitted from said an AC power supply into said plasma.

26. The apparatus of claim 5 wherein the number of turns is chosen so the electrical impedance appearing across the terminals of said plasma excitation means is approximately matched to the electrical impedance of said AC power source, whereby the AC electrical power from said AC power source is efficiently coupled into said plasma.